Electrodeposition of nanostructured Sn–Zn coatings

Salhi, Y.; Cherrouf, S.; Cherkaoui, Mohammed; Abdelouahdi, K.

doi:10.1016/j.apsusc.2016.01.132

Cited by 22 publications

(10 citation statements)

References 18 publications

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“…15b) varies also linearly. For the peak a, the line crosses the origin, therefore, the reaction rate is entirely controlled by the diffusion [37,46]. In contrast, for the peaks b and d, the extrapolation to v = 0 give bias currents equal to -9 and -14 mA cm -2 respectively.…”

Section: Influence Of the Potential Scan Ratementioning

confidence: 99%

“…In this study, we opted for citrate because it forms various electroactive aqueous complexes with Cu(II), Sn(II) and Zn(II) [26]. The starting bath composition was determined fromour previous work on the electrodeposition of nano-structured Sn-Zn alloy [37]. The concentration of copper sulphate and pH were fixed on the basis of the thermodynamic model proposed by Slupska and Ozga [38].…”

Section: Introductionmentioning

confidence: 99%

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Electrochemical deposition mechanism of copper-zinc-tin alloy and structural characterization

Bahi

Galai

Cherkaoui

et al. 2020

Surfaces and Interfaces

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The electrodeposition of Cu-Sn-Zn coating (CZT) was investigated. The bath consisted of aqueous solution of Cu, Sn and Zn sulphate in the presence of sodium citrate (NaC6H5Na3O7) as complexing agent. The pH was set between 4 and 5.5 to stabilize the bath. Cyclic voltammetry exhibited four peaks during cathodic scan corresponding to the reductions of metal ions and adsorbed hydrogen. Impedance measurements were made at each potential peak. The effect of the metal salts concentration and the potential scan rate were studied. The deposit mechanism is controlled by mass transfer in parallel with a faradaic reaction. For the deposition of Cu-Sn and Cu-Sn-Zn alloys, the average diffusion coefficients of Cu 2+ and Sn 2+ ions and Cu 2+ , Sn 2+ and Zn 2+ ions were calculated. At E = -1.5 V, a Cu-Sn-Zn deposit is obtained with 55 at% copper, 25 at% tin and 20 at% zinc. The X-ray diffraction pattern shows the characteristic peaks of Cu, Cu6Sn5 and Cu3Zn2 phases. The deposit morphology was characterized by SEM.

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Section: Influence Of the Potential Scan Ratementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Electrochemical deposition mechanism of copper-zinc-tin alloy and structural characterization

Bahi

Galai

Cherkaoui

et al. 2020

Surfaces and Interfaces

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“…Andrew et al revealed that Sn and Zn can be electrodeposited individually and as alloys from an electrolytic solution containing choline chloride and ethylene glycol or urea [14]. In addition, the electrodeposition of Sn-Zn alloys from an aqueous solution containing tartaric acid [15,16], citric acid [17][18][19], gluconic acid [20][21][22] and from an alkaline aqueous solution [23] has been investigated. While these research works revealed that Sn-Zn alloys can be electrodeposited from several types of electrolytic solutions, there are no reports on the solderability of electrodeposited Sn-Zn alloys.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films

Tsurusaki

Ohgai

2020

Materials

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Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate from an aqueous solution containing citric acid complexes. The electrodeposition behavior of Sn-Zn alloys was classified to a normal co-deposition type, in which electrochemically nobler Sn deposits preferentially compared to Zn. Electrodeposited Sn-Zn alloy films were composed of a non-equilibrium phase, like an enforced solid solution, which was not observed in an equilibrium phase diagram of an Sn-Zn binary alloy system. By applying a thermal annealing process at 150 °C for 10 minutes, a pure Zn phase was precipitated from an electrodeposited Sn-based solid solution phase with excessively dissolved Zn atoms. During the soldering process, intermetallic phases such as Cu3Sn and Cu5Zn8 were formed at the interface between an Sn-Zn alloy and Cu substrate. Tensile strength and fracture elongation of solder-jointed Cu rods with Sn-8 at.%Zn alloy films reached ca. 40 MPa and 12%, respectively.

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“…[4] In recent years, the electrodeposition of Sn has received considerable attention due to its non-toxicity, high resistance to corrosion, good ductility and its potential for use in electrochemical applications such as electronics and batteries. [5][6][7][8][9] Sn and its alloy coatings have been used in numerous industrial applications such as the automobile industry, [10] microelectronics, [11] aeronautics, [12] and the food industry. [13] Sn and its alloys have been widely used for imparting corrosion resistance to active metal substrates in aggressively corrosive environments.…”

Section: Introductionmentioning

confidence: 99%

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

Alesary¹

2019

International Journal of Electrochemical Science

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A number of studies into the influence of additives on the electrodeposition of metals from aqueous solution have been reported in the literature. However, very few have studied the influence of additives on metal electrodeposition in Deep Eutectic Solvents (DESs). This work will show, for the first time, the effect of sodium bromide on the electrodeposition of tin, copper, silver and nickel from a deep eutectic solvent (DES)-based ionic liquid consisting of a stoichiometric 1:2 mix of choline chloride and ethylene glycol (Ethaline 200). It is shown that in the presence of sodium bromide, bright and smooth Cu and Ni deposits were formed. Cyclic voltammetry and chronocoulometry have been used to examine the electrochemical properties of the plating liquids in both the absence and presence of sodium bromide. It was found that the redox peak currents of the Sn and Ag electrolytes get smaller when sodium bromide is added to the electrolyte solution. The resultant surface morphologies, topography and roughness of Sn, Cu, Ag and Ni were investigated by scanning electron microscopy (SEM/ EDXS) and 3D optical microscopy (3D). The current efficiency of metal deposits was found to increase when the deposition was achieved from an electrolyte that contained sodium bromide.

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Electrodeposition of nanostructured Sn–Zn coatings

Cited by 22 publications

References 18 publications

Electrochemical deposition mechanism of copper-zinc-tin alloy and structural characterization

Electrochemical deposition mechanism of copper-zinc-tin alloy and structural characterization

Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

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