Electrodeposition of nano-diamond/copper composite platings: Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface

Hagio, Takeshi; Park, Jae‐Hyeok; Naruse, Yuto; Goto, Yasuki; Kamimoto, Yuki; Ichino, Ryoichi; Bessho, Takeshi

doi:10.1016/j.surfcoat.2020.126322

Cited by 28 publications

(5 citation statements)

References 29 publications

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“…formation of poor interfacial bonding between the copper matrix and the diamond particles [58], and this may be attributed to the low efficiency of electrolysis [59]. Wu et al find that two competitive additives ((DVF-B, accelerator, DVF-C, inhibitor) can affect the microstructure, crystallization, interfacial combination of the composite materials [59].…”

Section: Figure 13mentioning

confidence: 99%

High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

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Copper/diamond composites have drawn lots of attention in the last few decades, due to its potential high thermal conductivity and promising applications in high-power electronic devices. However, the bottlenecks for their practical application are high manufacturing/machining cost and uncontrollable thermal performance affected by the interface characteristics, and the interface thermal conductance mechanisms are still unclear. In this paper, we reviewed the recent research works carried out on this topic, and this primarily includes (1) evaluating the commonly acknowledged principles for acquiring high thermal conductivity of copper/diamond composites that are produced by different processing methods; (2) addressing the factors that influence the thermal conductivity of copper/diamond composites; and (3) elaborating the interface thermal conductance problem to increase the understanding of thermal transferring mechanisms in the boundary area and provide necessary guidance for future designing the composite interface structure. The links between the composite’s interface thermal conductance and thermal conductivity, which are built quantitatively via the developed models, were also reviewed in the last part.

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Section: Figure 13mentioning

confidence: 99%

High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

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“…The different materials as the second solid phase in powder, whiskers, or fiber forms can be suspended in an electroplating bath and embedded into a metal deposit during the co-deposition process. Common materials used to reinforce the copper metal matrix were metal ceramic oxides such as corundum (Al 2 O 3 ) [13,14,16,17], silica (SiO 2 ) [18][19][20], titanium oxide (TiO 2 ) [21][22][23], CeO 2 [24], zirconia (ZrO 2 ) [25], Y 2 O 3 [26], nitrides (Si 3 N 4 ) [27,28], silicon carbide (SiC) [29,30], carbon nanotubes (CNTs) [31], multi-walled carbon nanotubes (MWCNTs) [32], graphene (Gr) and its derivatives such as graphene oxides (GO) and reduced graphene oxides (RGO) [33][34][35][36][37], diamonds [38,39], and LDH (layered double hydroxide) [40].…”

Section: Introductionmentioning

confidence: 99%

Mechanical Properties of Electrolytically Produced Copper Coatings Reinforced with Pigment Particles

Mladenović,

Vuksanović,

Dimitrijević

et al. 2023

Metals

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Copper from sulfate baths without and with added inorganic pigment particles based on strontium aluminate doped with europium and dysprosium (SrAl2O4: Eu2+, Dy3+) was electrodeposited on a brass cathode by a galvanostatic regime. Morphological, structural, and roughness analysis of the pigment particles, the pure (pigment-free) Cu coating, and the Cu coatings with incorporated pigment particles were performed using SEM, XRD, and AFM techniques, respectively. Hardness and creep resistance were considered for the examination of the mechanical properties of the Cu coatings, applying Chicot–Lesage (for hardness) and Sargent–Ashby (for creep resistance) mathematical models. The wettability of the Cu coatings was examined by the static sessile drop method by a measurement of the water contact angle. The incorporation of pigment particles in the Cu deposits did not significantly affect the morphology or texture of the coatings, while the roughness of the deposits rose with the rise in pigment particle concentrations. The hardness of the Cu coatings also increased with the increasing concentration of pigments and was greater than that obtained for the pigment-free Cu coating. The presence of the pigments caused a change in the wettability of the Cu coatings from hydrophilic (for the pigment-free Cu coating) to hydrophobic (for Cu coatings with incorporated particles) surface areas.

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“…Electrodeposition of metal platings accompanied by the codeposition of carbon materials, namely metal/carbon composite platings, has garnered reputation as a promising method for enhancing the properties or imparting additional functions to conventional metal platings [1,2]. In particular, the codeposition of carbon materials has been found to be an effective strategy for improving corrosion resistance [2][3][4], electrical conductivity [4,5], thermal conductivity [6][7][8], abrasion resistance [8,9], hardness [8][9][10], etc. Numerous carbon materials, including carbon black [11], carbon fibers [12,13], single-or multi-walled carbon nanotubes (CNTs) [2,4,5,9,10,14], graphene and its derivatives [3,8,15,16], and diamonds [6,7,[17][18][19] have been considered as filler materials for composite platings.…”

Section: Introductionmentioning

confidence: 99%

“…In particular, the codeposition of carbon materials has been found to be an effective strategy for improving corrosion resistance [2][3][4], electrical conductivity [4,5], thermal conductivity [6][7][8], abrasion resistance [8,9], hardness [8][9][10], etc. Numerous carbon materials, including carbon black [11], carbon fibers [12,13], single-or multi-walled carbon nanotubes (CNTs) [2,4,5,9,10,14], graphene and its derivatives [3,8,15,16], and diamonds [6,7,[17][18][19] have been considered as filler materials for composite platings. Although several carbon filler materials are in use, an appropriate carbon material should be chosen according to the desired performance of the plating and environment where it will be used [2].…”

Section: Introductionmentioning

confidence: 99%

Preliminary Study on Electrodeposition of Copper Platings and Codeposition of Carbon Nanotubes from Organic Solvent

et al. 2023

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Metal/carbon composite plating is an effective strategy for improving and adding properties to metal plating by incorporating carbon materials into the metal matrices. Copper (Cu) is widely applied, particularly in the areas of heat management and electronic packaging owing to its high thermal and electrical conductivities, which can be further improved together with improvements in mechanical properties by compositing it with carbon nanotubes (CNTs). However, because hydrophobic CNTs are hardly dispersible in aqueous solutions, additional intense acid treatment or the addition of dispersants is required for their dispersion. Moreover, previous studies have reported that these methods suffer from deterioration of composite material performance through the destruction of the CNT surface or the inclusion of dispersants into the plating. Therefore, in this study, the electrodeposition of a Cu/CNT composite in a non-aqueous solvent that can disperse CNTs without any additional treatment is investigated. The experimental results show that it is possible to deposit Cu from a N-methyl-2-pyrrolidone containing copper iodide and potassium iodide. Furthermore, Cu/CNT composite platings containing CNTs up to 0.12 mass% were prepared by constant current electrolysis, and applying pulse electrolysis can increase the CNTs content up to 0.22 mass%.

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Electrodeposition of nano-diamond/copper composite platings: Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface

Cited by 28 publications

References 29 publications

High thermal conductive copper/diamond composites: state of the art

High thermal conductive copper/diamond composites: state of the art

Mechanical Properties of Electrolytically Produced Copper Coatings Reinforced with Pigment Particles

Preliminary Study on Electrodeposition of Copper Platings and Codeposition of Carbon Nanotubes from Organic Solvent

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