Electrodeposition of low residual stress CoNiMnP hard magnetic thin films for magnetic MEMS actuators

Guan, Sujun; Nelson, Bradley J.

doi:10.1016/j.jmmm.2004.10.094

Cited by 67 publications

(20 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Further, the process of pore creation in the AAO does not actually produce perfectly cylindrical cavities, with perfect hexagonal arrangement. Previous studies have demonstrated that these e↵ects are accounted for by using an empirical current e ciency ↵ of 0.9 [23,24].…”

Section: Resultsmentioning

confidence: 99%

Directed self-assembly of nanorod networks: bringing the top down to the bottom up

et al. 2012

View full text Add to dashboard Cite

Abstract. Self-assembled electrodeposited nanorod materials have been shown to o↵er an exciting landscape for a wide array of research ranging from nanophotonics through to biosening and magnetics. However, until now, the scope for site-specific preparation of the nanorods on wafers is limited to local area definition. Further there is little or no lateral control of nanorod height. In this work we present a scalable method for controlling the growth of the nanorods in the vertical direction as well as their lateral position. A focused ion beam (FIB) pre-patterns the Au cathode layer prior to the creation of the Anodized Aluminium Oxide (AAO) template on top. When the pre-patterning is of the same dimension to the pore spacing of the AAO template, lines of single nanorods are successfully grown. Further, for sub-200 nm wide features a relationship between the nanorod height and distance from non-patterned cathode can be seen to follow a quadratic growth rate obeying Faradays law of electrodeposition. This facilitates lateral control of nanorod height combined with localised growth of the nanorods.

show abstract

Section: Resultsmentioning

confidence: 99%

Directed self-assembly of nanorod networks: bringing the top down to the bottom up

et al. 2012

View full text Add to dashboard Cite

show abstract

“…To eliminate these micro cracks, some new additives need to be added. For instance, a hybrid residual stress reliever composed of sodium saccharine and a rare-earth salt was created to improve surface morphology [12].…”

Section: Rsults and Discussionmentioning

confidence: 99%

“…The group VA (e.g., P, As, Sb and Bi) and VIB (e.g., W, Mo and Cr) elements are capable of increasing the coercivity of Co-Ni alloy and among these elements P is the most effective [11]. The boric acid could keep the divalent cobalt cation from being oxidized [12]. Besides, the cobalt foil was used as anode to maintain the constant cobalt cation concentration in the electrolyte.…”

Section: Electrodeposition Techniquementioning

confidence: 99%

Electrodeposition and characterization of CoNiMnP-based permanent magnetic film for MEMS applications

Sun

Yuan

Fang

et al. 2011

2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

View full text Add to dashboard Cite

Electroplated CoNiMnP-based permanent magnetic films with thickness of 4 m, 25 m and 43.5 m were fabricated and tested. Composed of 76.38 wt% Co, 16.66 wt% Ni, 3.64 wt% P and 2.32 wt% Mn, the films exhibited good surface morphology. In the case of 4 m thick film, we successfully achieved a high lateral coercivity of 711Oe, a retentivity up to 8933Gs and an energy density of 16.9kJ/m 3 . The film thickness dependence of magnetic property was also investigated, showing a decrease of the retentivity and coercivity with the increase in thickness. In addition, it was observed that Zn as an additive could improve the surface morphology by eliminating micro cracks.

show abstract

“…Although hard magnetic materials have not been typically used in magnetic-MEMS, they have several advantages for magnetic actuation, including low power requirements, high remanence, and high coercivity, which have motivated investigators to develop new electrodeposition processes for these materials. Many of these permanent or hard magnetic materials are Co-based with the inclusion of a nonmagnetic material, typically P, to increase coercivity [10,12].…”

Section: Electrodepositionmentioning

confidence: 99%

Electrochemically Fabricated Microelectromechanical Systems/Nanoelectromechanical Systems (MEMS/NEMS)

Hangarter

George²,

Myung

2009

Nanostructure Science and Technology

View full text Add to dashboard Cite

Microelectromechanical Systems (MEMS) [1] and its more recent extension Nanoelectromechanical Systems (NEMS) [2] are successful offshoots of the semiconductor revolution, which was the hallmark of the latter half of the previous century [3]. Both MEMS and NEMS have established themselves as successful fields of endeavor in their own right. In fact, it is fair to say that all nonintegrated circuit (IC) technologies are included under the MEMS/NEMS umbrella. Although the vast majority of MEMS/NEMS technologies deal with the design and fabrication of novel sensors and actuators [3], ancillary technologies such as interconnects and packaging form an important part of MEMS and NEMS [4]. In many cases, MEMS/ NEMS also find applications, not as stand-alone devices but as the key enabling subcomponents of otherwise conventionally fabricated systems [2]. This chapter will provide a survey of MEMS/NEMS fabrication and device technologies with particular emphasis on electrochemistry-based fabrication techniques and novel devices/instruments technologies that can be developed using electrochemistry. Electrochemical Fabrication Techniques in MEMS/NEMSElectrochemical fabrication techniques offer tremendous versatility as cost-effective methods to generate MEMS/NEMS materials and structures. The batch processing nature of these methods carried out at near room temperature in ambient pressure, C.M. Hangarter and N.V. Myung ()

show abstract

Electrodeposition of low residual stress CoNiMnP hard magnetic thin films for magnetic MEMS actuators

Cited by 67 publications

References 11 publications

Directed self-assembly of nanorod networks: bringing the top down to the bottom up

Directed self-assembly of nanorod networks: bringing the top down to the bottom up

Electrodeposition and characterization of CoNiMnP-based permanent magnetic film for MEMS applications

Electrochemically Fabricated Microelectromechanical Systems/Nanoelectromechanical Systems (MEMS/NEMS)

Contact Info

Product

Resources

About