Electrodeposition of Fe−Pt Films with Low Oxide Content Using an Alkaline Complexing Electrolyte

Liang, Defu; Mallett, Jonathan J.; Zangari, Giovanni

doi:10.1021/am100066x

Cited by 20 publications

(19 citation statements)

References 17 publications

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“…This is referred to as underpotential alloy co-deposition (UPCD) [16] and has been studied in detail and implemented for the growth of alloys with controlled thickness, structure, and composition. One direction of UPCD studies followed the deposition of Pt alloys aimed at applications in the electronic industry (Pt-Co, Pt-Fe) [17][18][19][20] and catalysis (Pt-Cu, Pt-Pb) [21][22][23]. From a fundamental standpoint UPCD has been of interest with its ability to produce metastable configurations in electrodeposited Au-Ni alloys [24] and to ensure a great deal of compositional control by even inverting the thermodynamics of the co-depositing metals (Au-Cu alloys) [25,26].…”

Section: Introductionmentioning

confidence: 99%

Recent Advances in the Growth of Metals, Alloys, and Multilayers by Surface Limited Redox Replacement (SLRR) Based Approaches

Dimitrov

2016

Electrochimica Acta

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A B S T R A C TIn the realm of ever increasing importance of nanotechnology, the deposition of ultrathin metal/alloy layers with perfect structure and unique functionality becomes an objective of paramount importance. In the last decade many research groups have been working on the development and application of a new method for epitaxial thin film growth that employs a surface limited redox replacement (SLRR) as a building block reaction. The multiple repetition of this reaction enables the controlled deposition of a monolayer of metal or alloy per cycle. Work in the field has been done on the development of SLRR deposition protocols along with understanding and modelling of the SLRR reaction kinetics, on comparative studies of SLRR based routines, and on other deposition approaches. Most recently, the development of SLRR was extended to the application of all-electroless approaches for carrying out the SLRR (ESLRR). In this paper an overview of all SLRR, ESLRR and related approaches is presented. The description of the background and reaction formalism introduces the method with emphasis on its general applicability and limitations. The discussion then continues with the description of experimental approaches for carrying out a deposition process by SLRR. In this section specific consideration is given to the deposition by shuttling of the working electrode, the flow-cell configuration, the one-cell configuration, and the all-electroless approaches for realizing the repetitive application of a single-cycle SLRR reaction. Next, the ability of these approaches to produce epitaxial, flat and uniform deposits will be discussed through results of electrochemical, in-situ scanning tunneling microscopy, X-ray Photoelectron Spectroscopy and other characterization experiments showing advantages and limitations of SLRR growth in a variety of systems classified into three categories. In the first of these categories Cu, Ag, and Au are used as model systems to introduce the deposition by SLRR. In the second category Pd and Ru deposition by SLRR has been discussed. In the third category all studies concerning a variety of scenarios for Pt deposition by SLRR are presented and in the last part of that section deposition of alloys and multilayers is critically discussed. The paper then continues with a section presenting and discussing modelling approaches of studying the kinetics of a single-cycle SLRR reaction and concludes with the presentation of the extension of modelling to a system where multi-cycle SLRR deposition processes have been investigated. The analysis in this part focuses on the kinetic parameters of the replacement reaction like rate constant, order of the reaction, type of adsorption behavior of the sacrificial metal etc. Finally, this section concludes with a discussion of the mechanistic aspects of the SLRR reaction and more specifically on the factors impacting the deposition process and in turn the resulting structure, morphology, uniformity and continuity of the accordingly grown thin films. The paper a...

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Section: Introductionmentioning

confidence: 99%

Recent Advances in the Growth of Metals, Alloys, and Multilayers by Surface Limited Redox Replacement (SLRR) Based Approaches

Dimitrov

2016

Electrochimica Acta

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“…• C. [9][10][11][12] The major disadvantage for use of these materials in BPM is high annealing temperature, which can deteriorate the thermal stability of the whole stack in BPM, i.e. substrate, SUL, under layer and magnetic layer.…”

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confidence: 99%

Electrodeposition of Thin CoPt Films with Very High Perpendicular Anisotropy from Hexachloroplatinate Solution: Effect of Saccharin Additive and Electrode Substrate

Tabaković

Qiu

Dragos

2016

J. Electrochem. Soc.

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The CoPt films with 9.7-91 at% Co and thicknesses of 15-20 nm were obtained from a new designed stable hexachloroplatinate solution at a controlled potential deposition. The effects of the substrate (Ru and Cu) and an organic additive (saccharin) on composition, crystal structure and magnetic properties of the CoPt films were studied. It was demonstrated that a Ru electrode substrate provides well-defined surface for the epitaxial growth of hcp phase, resulting in high perpendicular anisotropy. The addition of saccharin (Sacc) as an organic additive into the plating solution caused a dramatic improvement of the epitaxial growth of CoPt film on the Ru substrate. At the film thickness of interest, for bit-patterned media BPM (15-20 nm), the out-of-plane coercivity showed the highest value of 6700 Oe and the squarness M r /M s ∼1. The areal density of hard disc drives has been increasing at 25-35% per year and now it is approaching to 1 Tb/in 2 . The magnetic crystal grain volume (V) has been decreasing to several cubic nanometers which is near to the thermal instability of granular media, i.e. the superparamagnetic limit. In order to further increase the areal density thermal stability factor, K u V/kT, needs to be kept within 40-60 range. The superparamagnetic effect posses a serious challenge for continuing to increase the areal density and storage capacity of disc drives.1 In order to solve these problems the intensive research and development efforts are currently being carried out worldwide with two major concepts. The first one is to use high magnetoanisotropy (K u ) granular media, i.e. FePt or CoPt alloys, and develop a heat-assisted magnetic recording (HAMR) writer.2 The second is to use conventional perpendicular writer and develop a bit-patterned media (BPM) that effectively increase the grain volume (V).3 Both concepts need to overcome numerous technical challenges in R&D in order to manufacture recording heads with areal density >1 Tb/in 2 and stability over 10 years of data storage.The main idea of BPM technology is that each bit is stored in a single dimensionally defined magnetic switching volume, i.e. dot. Different methods-electron beam lithography (EBL), nanoimprint lithography (NIL), block co-polymer (BCP)-for the fabrication of nano-holes with the long-range ordering and diameter of sub-20 nm corresponding to the density of ∼1 Tdot/in 2 have been demonstrated. 4,5 A typical perpendicular media comprises of a multilayer structure including a substrate covered by a soft magnetic under layer (SUL), an interlayer (seed layer) and hard patterned magnetic layer (BPM). The hard magnetic layer can be a CoPt or FePt electrodeposited alloy of hcp-crystal structure with crystalline grains oriented along the c-axis (the magnetic easy axis) in the direction normal to the film. The important magnetic property at the thickness of interest in BPM (15-20 nm) is high out-of-plane coercivity (H c ) which is largely determined by magnetocrystalline anisotropy and to a lesser extent by shape anisotropy of magneti...

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“…UPCD of Pt with the transition metals Fe, Co, Ni however resulted in codeposition only under diffusion limiting conditions for Pt, resulting in hydrogen evolution, pH increase at the interface, and oxygen incorporation in the films [54]. This problem was overcome by utilizing a Pt complex to shift the onset of Pt deposition more negative, leading to closer onset potentials for Fe and Pt and mostly avoiding oxygen incorporation [56,57]; the improved purity also resulted in an earlier onset of the phase transformation of FCC Fe-Pt to the high anisotropy tetragonal structure of interest in magnetic recording [58].…”

Section: Interactions In the Solidmentioning

confidence: 99%

Electrodeposition of Alloys and Compounds in the Era of Microelectronics and Energy Conversion Technology

Zangari

2015

Coatings

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Electrochemical deposition methods are increasingly being applied to advanced technology applications, such as microelectronics and, most recently, to energy conversion. Due to the ever growing need for device miniaturization and enhanced performance, vastly improved control of the growth process is required, which in turn necessitates a better understanding of the fundamental phenomena involved. This overview describes the current status of and latest advances in electrodeposition science and technology. Electrochemical growth phenomena are discussed at the macroscopic and atomistic scale, while particular attention is devoted to alloy and compound formation, as well as surface-limited processes. Throughout, the contribution of Professor Foresti and her group to the understanding of electrochemical interfaces and electrodeposition, is highlighted.

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Electrodeposition of Fe−Pt Films with Low Oxide Content Using an Alkaline Complexing Electrolyte

Cited by 20 publications

References 17 publications

Recent Advances in the Growth of Metals, Alloys, and Multilayers by Surface Limited Redox Replacement (SLRR) Based Approaches

Recent Advances in the Growth of Metals, Alloys, and Multilayers by Surface Limited Redox Replacement (SLRR) Based Approaches

Electrodeposition of Thin CoPt Films with Very High Perpendicular Anisotropy from Hexachloroplatinate Solution: Effect of Saccharin Additive and Electrode Substrate

Electrodeposition of Alloys and Compounds in the Era of Microelectronics and Energy Conversion Technology

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