Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Costello, Suzanne; Strusevich, N.; Flynn, David; Kay, Robert W.; Patel, Mayur; Bailey, Christopher; Price, Dennis; Bennet, Mathieu; Jones, Anita C.; Desmulliez, Marc Phillipe Yves

doi:10.1007/s00542-013-1746-7

Cited by 22 publications

(12 citation statements)

References 4 publications

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“…Previous simulations have highlighted that the increases in forced streaming currents by MS acoustics are weak so as to not significantly contribute to fluid transport down high aspect ratio vias (Strusevich et al , 2013). Regardless, increases to plating efficiencies have been observed (Costello et al , 2013).…”

Section: Discussionmentioning

confidence: 99%

“…A candidate method for enhancing the performance of traditional electroplating and providing Cu filling is the introduction of a megasonic (MS; 1 MHz) transducer as a way to induce acoustic streaming to enhance Cu ion transfer. The introduction of megasound has been shown to improve plating speed and filling quality on the electrodeposition of Cu in situations where the ratio between thickness down the via and on the surface is close to 1:1 (Hyde and Compton, 2002; Costello et al , 2013).…”

Section: Introductionmentioning

confidence: 99%

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Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Jones¹,

Flynn²,

Desmulliez³

et al. 2016

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Purpose ± A study of the influence of megasonic (MS) assisted agitation on Printed Circuit Boards (PCBs) electroplated using copper electrolyte solutions, to improve plating efficiencies through enhanced ion transportation. Design/methodology/approach-The impact of MS assisted agitation on topographical properties of the electroplated surfaces studied, through a Design of Experiments (DOE), by measuring surface roughness, characterised by values of the parameter Ra as measured by white light phase shifting interferometry and high resolution scanning electron microscopy. Findings ± An increase of Ra from 400 nm to 760 nm measured after plating, for an increase to acoustic power from 45 W to 450 W. Roughening increase due to micro-bubble cavitation energy, supported through direct imaging of the cavitation. Current thieving effect by the MS transducer induced low-currents, leading to large Cu grain frosting reducing the board quality. Current thieving was negated in plating trials through specific placement of transducer. Wavy electroplated surfaces, due to surface acoustic waves, also observed reducing the uniformity of the deposit. Research limitations/implications ± The formation of unstable transient cavitation and variation of the topology of the copper surface are unwanted phenomena. Further plating studies using megasonic agitation are needed, along with fundamental simulations, to determine how the effects can be reduced or prevented. Practical implications ± Identify manufacturing settings required for high-quality MS assisted plating and promote areas for further investigation, leading to the development of an MS plating manufacturing technique. Originality/value ± Quantification of the topographical changes to a PCB surface in response to megasonic agitation and evidence for deposited copper artefacts due to acoustic effects.

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Jones¹,

Flynn²,

Desmulliez³

et al. 2016

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“…A thicker layer is produced at the TSV opening due to high current density, while a thin layer is produced at the bottom. Therefore, various attempts, such as applying low current density, optimizing organic additives in the plating solution, and using megasonic agitation are currently being studied for DC to fill a via with Cu (Choi et al, 2012;Costello et al, 2013). Figure 2 shows different Cu filling behaviours when DC was applied in a plating bath consisting of copper sulfate (CuSO 4 ) and sulfuric acid (H 2 SO 4 ) with appropriate organic additives (Noh et al, 2011).…”

Section: Direct Current Methodsmentioning

confidence: 99%

Section: Direct Current Methodsmentioning

confidence: 99%

Cu filling of TSV using various current forms for three‐dimensional packaging application

Roh

Lee²,

Kim³

et al. 2013

Soldering &Amp; Surface Mount Technology

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If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The purpose of this paper is to overview the effect of electroplating current wave forms on Cu filling of through-silicon-vias (TSV) for threedimensional (3D) packaging. Design/methodology/approach -The paper takes the form of a literature review. Findings -Effective TSV technology for 3D packaging involves various processes such as via formation, filling with conductive material, wafer thinning, and chip stacking. Among these processes, high-speed via filling without defect is very important for applying the TSV process to industry with a lower production cost. In this paper, the effects of various current forms on Cu electroplating of TSV such as direct current (DC), pulse current (PC), pulse reverse current (PRC), and periodic pulse reverse current (PPR) are described in detail including recent studies. Originality/value -TSV is a core technology for high density 3D packaging. This paper overviews the recent studies of various current forms on Cu-filling of TSV.

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“…The hole between the pads (the capture pad and target pad) of the two conductive layers can be drilled by mill or laser, and then coated with conductors by electroplating. The hole should be large enough to enable the deposition process (usually larger than 75 µ m (Costello et al, 2013; Yen et al, 2012)). The two pads should be larger than the through hole to tolerate fabrication errors during drilling.…”

Section: Actuator Designmentioning

confidence: 99%

Biologically inspired electrostatic artificial muscles for insect-sized robots

Wang

York

Chen

et al. 2021

The International Journal of Robotics Research

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Millimeter-sized electrostatic film actuators, inspired by the efficient spatial arrangement of insect muscles, achieve a muscle-like power density (61 W kg−1) and enable robotic applications in which agility is needed in confined spaces. Like biological muscles, these actuators incorporate a hierarchical structure, in this case building from electrodes to arrays to laminates, and are composed primarily of flexible materials. So comprised, these actuators can be designed for a wide range of manipulation and locomotion tasks, similar to natural muscle, while being robust and compact. A typical actuator can achieve 85 mN of force with a 15 mm stroke, with a size of [Formula: see text] mm3 and mass of 92 mg. Two millimeter-sized robots, an ultra-thin earthworm-inspired robot and an intestinal-muscle-inspired endoscopic tool for tissue resection, demonstrate the utility of these actuators. The earthworm robot undertakes inspection tasks: the navigation of a 5 mm channel and a 19 mm square tube while carrying an on-board camera. The surgical tool, which conforms to the surface of the distal end of an endoscope, similar to the thin, smooth muscle that covers the intestine, completes tissue cutting and penetrating tasks. Beyond these devices, we anticipate widespread use of these actuators in soft robots, medical robots, wearable robots, and miniature autonomous systems.

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Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Cited by 22 publications

References 4 publications

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Cu filling of TSV using various current forms for three‐dimensional packaging application

Biologically inspired electrostatic artificial muscles for insect-sized robots

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