Electrodeposition of copper into functionalized polypyrrole films

2004

Electrochimica Acta

115

The oxidation and photo-induced oxidation of glucose at a copper-dispersed polyaniline film was studied in an alkaline hydroxide solution. It was found that the copper-dispersed polyaniline electrode was capable of oxidizing glucose at potentials between 0.2 and 0.75 V/(Ag|AgCl), with the rate of oxidation being higher than that observed at a bulk copper electrode. On irradiation of the composite with polychromatic UV light, a further increase in the rate of the glucose oxidation reaction was observed. Formate was identified as the main product of the glucose oxidation reaction under both light and dark conditions using 1 H NMR spectrometry. This suggests that illumination does not alter significantly the reaction pathway.

Section: Preparation and Electrochemical Characterization Of The Modisupporting

confidence: 94%

“…In recent years there have been many reported studies on the incorporation of metal particles within a conducting polymer matrix, such as polyaniline or polypyrrole [1][2][3][4][5][6][7]. This incorporation can be achieved readily by the reduction of the appropriate metal salt at the conducting polymer interface.…”

Section: Introductionmentioning

confidence: 99%

Oxidation and photo-induced oxidation of glucose at a polyaniline film modified by copper particles

Farrell

2004

Electrochimica Acta

115

“…On polarising further in the anodic direction, more intense dissolution is seen with current peaks being observed at 360 and 490 mV (SCE). These appear to be connected with the formation of Cu(II) oxalates, with the likely oxalates being Cu(Ox) and (Cu(Ox) 2 ) 2( , where Ox represents the oxalate species [17]. The current increases again on polarization to potentials in the region of 1000 mV (SCE).…”

Section: Resultsmentioning

confidence: 99%

“…5(b), that if the electrodes are subjected to high potentials in the region of 1000 mV(SCE), then the copper oxalate species loose their protective properties, and thus are unable to protect the substrate, as evident from the reverse scans where high anodic currents are seen. Zouaoui et al [17] have shown clearly that (Cu(Ox ) 2 ) 2( is the more stable complex in the pH range 3.0 to 11.0 for a solution of Cu 2' and Ox 2( . Thus, this Cu oxalate layer is likely to contain copper as the (Cu(Ox) 2 ) 2( species.…”

Section: Discussionmentioning

confidence: 97%

The electrochemical synthesis of polypyrrole at a copper electrode: corrosion protection properties

Fenelon

2002

Electrochimica Acta

173

Pyrrole was successfully electropolymerized at a copper electrode in a near neutral sodium oxalate solution to generate a homogeneous and adherent polypyrrole film. The growth of these films was facilitated by the initial oxidation of the copper electrode in the oxalate solution to generate a copper oxalate pseudo-passive layer. This layer was sufficiently protective to inhibit further dissolution of the copper electrode and sufficiently conductive to enable the electropolymerization of pyrrole at the interface, and the generation of an adherent polypyrrole film. These films remained stable and conducting for periods exceeding eight days and exhibited significant corrosion protection properties in acidified and neutral 0.1 mol dm (3 NaCl solutions even on polarization to high anodic potentials. #

“…On polarizing further in the anodic direction, more intense dissolution is seen with current peaks being observed at approximately 360 and 490 mV(SCE). These appear to be connected with the formation of Cu(II) oxalates, with the likely oxalates being Cu(Ox) and Cu(Ox) 2À 2 , where Ox represents the oxalate species [18,20]. On the second and subsequent cycles, the potential at which these reactions occur increases in the anodic direction which suggests some stabilization of the copper electrode as a result of the formation of copper-oxalate corrosion products on the surface.…”

Section: Formation Of Polypyrrole At Cunimentioning

confidence: 98%

The electropolymerization of pyrrole at a CuNi electrode: corrosion protection properties

Fenelon

2003

Corrosion Science

Pyrrole was successfully electropolymerized at a copper-nickel electrode in a near-neutral sodium oxalate solution containing Cu 2þ cations to generate a homogenous and adherent polypyrrole film. The presence of the Cu 2þ ions increased both the rate of the electropolymerization reaction and the adherence of the polymer at the CuNi interface. In the absence of these cations, oxidation of the electrode occurred generating a nickel-rich layer that was not sufficiently conducting, under the electropolymerization conditions employed, to facilitate the electron-transfer reaction and the electropolymerization of pyrrole.These films remained stable and exhibited significant corrosion protection properties in acidified and neutral 0.1 mol dm À3 NaCl solutions even on polarization of the electrodes to high anodic potentials.