Electrodeposition of Aluminum on Cathodes in Ionic Liquid Based Choline Chloride/Urea/ALCL3

Abstract

Electrodeposition of aluminum on metal at low temperatures, with the participation of the ionic liquid electrolyte will contribute to solving many technical issues in critical industries such as automobiles, aircraft, electronics ... the industry uses aluminum and aluminum coated materials most.Using ionic liquids based on choline chloride and urea to electrodeposition of aluminum is more published in scientific journals in the world. In this article, we present the preliminary results of electrodeposition of aluminum on cathodes as copper, iron and especially glassy carbon. The nature of electrolytes based on choline chloride and urea were analyzed and identified. The solubility of aluminum chloride in this mixture also surveyed. The results showed that only choline chloride mixture / urea with a mole ratio of 1:1 solution is to create transparent and recrystallized at room temperature. The nature of electrolytes based on choline chloride and urea were analyzed and identified. The solubility of aluminum chloride in this mixture also surveyed. The results showed that only choline chloride mixture / urea with a mole ratio of 1:1 solution is to create transparent and recrystallized at room temperature. Solubility of aluminum chloride in this system is 5% by weight. So in the study of aluminum deposited on the cathode, we use only liquid choline chloride / urea / AlCl 3 at the rate of 1 mol / 1 mol + 5% by weight of AlCl 3 . The electroplating are made with temperatures from 90-120 ° C, the time is 2 hours. Distance between two poles is 2 cm, the maximum of surface area 3 cm 2 voltage between the two poles from 1-3 V and amperage stable at 100 -150 mA. Nitrogen environment are set to limit the influence of oxygen and hydrogen. The results of the analysis on the cathode structure of aluminum films by XRD, SEM, XRF, EDS ... showed similarities with the aluminum anode. The purity of the aluminum film obtained depending on the materials used as the cathode. The purity of aluminum on the GC-cathode is 92.42 % atom, on iron is 70.33 % atom and on copper is 82.63 % atom.

Development of an AlCl3-Urea Ionic Liquid for the Electroless Deposition of Aluminum on Carbon Nanotubes

“…To metallize nonconductive substrates, electroless plating has become a frequently adopted technique due to its simplicity, reproducibility, and low cost. Metals such as nickel and copper were found to be easily deposited using electroless plating in aqueous solutions. − On the other hand, the electroless deposition of aluminum was found to be unfeasible in aqueous solutions due to the narrow electrochemical window of water and the nature of aluminum as a less noble metal. − However, using room-temperature ionic liquids (RTILs), scientists were able to successfully electrodeposit aluminum on different substrates. − A commonly used method for the electroless deposition of aluminum is based on AlCl 3 -1-ethyl-3-methylimidazolium chloride (AlCl 3 -EMIC) ionic liquid with either diisobutylaluminum hydride (DIBAH) in toluene as a liquid reducing agent, or lithium hydride (LiH) as a solid reducing agent. − , The AlCl 3 -EMIC ionic liquid provides Al 2 Cl 7 – ions, which are the main species for aluminum deposition when reduced by the electrons associated with the reducing agent. Attempting to use AlCl 3 -EMIC RTIL to apply aluminum coats on nanostructures of very high surface area to volume ratios can be costly.…”

Progress in Novel Electrodeposited Bond Coats for Thermal Barrier Coating Systems

“…Figure 4 a compares the cost of preparing a 1 L plating solution using ILs that are employed for the electrodeposition of Al from the commercially developed ILs and the ones that were demonstrated to be potentially viable. The cost required for the makeup is calculated and presented considering the volume of individual constituents that are required to be added to prepare 1 L fresh IL solution by considering the IL systems from the references [ 31 , 72 , 73 , 74 ], and the value of each constituent is calculated based on the known market price. From the Figure 4 a, it can be noted that the make-up cost for ChCl:urea-based IL is the least among the ILs.…”

“… Plots showing the cost comparison of the ( a ) ionic liquid-based systems, an inorganic molten salt system for the electrodeposition of Al [ 31 , 72 , 73 , 74 , 75 ], and aqueous electrolyte for the electrodeposition of Pd [ 48 ]; ( b ) the ionic liquid-based systems for the electrodeposition of Al-alloys [ 71 ], considering the initial make up of 1 L solution. Electrodeposition of Al-Ti alloy from solution containing TiCl 2 and TiCl 4 is represented as Al-Ti’ and Al-Ti”, respectively.…”

“…Since the BPyrCl-AlCl 3 -based system and platinum electroplating solutions are too expensive, they are not presented in the figure as this would overtly skew the data. [31,[72][73][74][75], and aqueous electrolyte for the electrodeposition of Pd [48]; (b) the ionic liquid-based systems for the electrodeposition of Al-alloys [71], considering the initial make up of 1 L solution. Electrodeposition of Al-Ti alloy from solution containing TiCl 2 and TiCl 4 is represented as Al-Ti' and Al-Ti", respectively.…”

Electrodeposition from Deep Eutectic Solvents

“…These may include highly reactive metals like samarium [40,56] or inert metals such as indium [44]. In addition, the electrodeposition of metals which reduction potential falls outside the electrochemical window of water, like Al [70], can be in principle achieved. Their plating however must be performed in inert atmosphere with anhydrous solutions and a coating quality lower than imidazolium-based ionic liquids is in general achieved [71,72].…”