Electrodeposition of Aluminum Alloys

Blue, R. D.; Mathers, F. C.

doi:10.1149/1.3498213

Cited by 10 publications

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“…Emf measurements were also reported by Blue and Mathers in 19 3 6 22 and by Capuano, Ducassi, and Davenport in 1979.23 These authors used solutions containing HBr instead of KBr (or other alkali bromides) and did not add a salt of the metal studied.…”

Section: Introductionmentioning

confidence: 75%

Nernst plots and formal potentials in a nonpolar solvent consisting of aluminum bromide (Al2Br6) and potassium bromide in ethylbenzene

Elam¹,

Bahatt²,

Peled³

et al. 1984

J. Phys. Chem.

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Nernst plots and formal potentials were determined for four metals (Pb, Sn, Cu, Ag). The two divalent ions (Sn, Pb) yield the expected slope of 2.3RT/2F. A maximum is observed when the concentration of the salt approaches that of free A1,Br6. This is accounted for quantitatively in terms of the various ionic species, i.e. [M(A12Br,)]+, [M(AI,Br,),]-and [M(AlBr4)]+, [M(AIBr,),]-for a divalent metal (M), which can be stable in this nonpolar solvent system. Copper is found to occur in solution only in the monovalent state, even when CuBr, is dissolved. The Nernst slope is (5/6)(2.3RT/F), which is consistent with the participation of both the positive ( [Cu2(AI2Br7)]+ or [Cu,(AIBr,)]+) and negative ([Cu(AI,Br,),]-or [Cu(AlBr,),]-) complex ions in setting the equilibrium at the interface.For silver a Nernst slope of 2.3RT/F is observed. Oxidation of lead or tin to the tetravalent state was not observed in the range of potential available up to bromine evolution. When CuBr, was dissolved, a disproportionation reaction took place, with formation of free bromine and monovalent copper, as evidenced by the appearance of the bromo derivative of the solvent. A listing of formal potentials, measured here and in earlier publications, shows that the scale of emf values is considerably compressed compared to that of aqueous solutions (from 2.75 V to 1.5

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Section: Introductionmentioning

confidence: 75%

Nernst plots and formal potentials in a nonpolar solvent consisting of aluminum bromide (Al2Br6) and potassium bromide in ethylbenzene

Elam¹,

Bahatt²,

Peled³

et al. 1984

J. Phys. Chem.

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“…This favors the formation of monomeric aluminum complexes and partly justifies the stoichiometry of Eq. [1] given above.…”

Section: A12x~ + Arh - (A1x2 Arh) ~ + (A1x4)-[3] Complexmentioning

confidence: 95%

“…The earliest attempts to plate aluminum alloys were made by Blue and Mathers (1), who utilized an electrolyte containing aluminum halogen salts, dissolved in an aromatic solvent and ethyl bromide. Capuano and coworkers (2)(3)(4)(5)(6)(7)(8)(9)(10)(11) have developed a process for the electrodeposition of aluminum that could be used on an industrial scale in the near future.…”

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confidence: 99%

“…A cathodic polarization study by Capuano and Davenport (3) has proven that aluminum can only be plated if the aluminum bromide is in its monomeric form. The following plating reaction has been proposed for ethyl benzene electrolytes 2(A1Br2nC6H~C2H.~) + + 3e --* A1 + (A1Br4)-+ 2nC~H.~C2H~ [1] Choi and Brown (12) reported that unbranched or lower branched aromatic solvent molecules, such as benzene and toluene, produce mostly dimeric complexes of the type…”

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confidence: 99%

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Electrodeposition of Aluminum‐Tin Alloys from Organic Electrolytes

Platis

Capuano

1987

J. Electrochem. Soc.

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Aluminum‐tin alloys were electrodeposited onto steel from alkyl benzene, AlBr3‐normalHBr electrolytes. Bright, adherent, and coherent aluminum‐tin coatings were obtained at cathode efficiencies approaching 100%. The composition of the cathode deposit can be readily controlled by using Al‐Sn anodes of specified tin content. If the current density, agitation, and specific conductance are maintained constant, the electrolyte tin concentration acquires a constant value after a working up period. With electrolytes having conductivities of 3–6×10−3 Ω−1 cm−1 , 100% of the tin dissolved from the anodes is transferred to the cathode, whereas, with electrolytes having conductivities of 2–3×10−3 Ω−1 cm−1 , only about half the tin content from the anodes is actually electroplated. The codeposition of tin in the electrodeposition of aluminum‐tin alloys was found to be a diffusion rate controlling process.

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“…Manuscript received October 12, 1955. This paper was prepared for delivery before the Boston Meeting, October [3][4][5][6][7]1954.…”

Section: December 1956mentioning

confidence: 99%

Electrodeposition of Metals from Organic Solutions

Brenner

1956

J. Electrochem. Soc.

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General principles, methods, solutes, and solvents used for depositing metals from organic solvents are surveyed. This paper covers general principles and methods for electrodepositing metals from nonaqueous media that are common to four subsequent papers in this series concerned with deposition of A1, Be, Mg, and alloys of A1 with Ti and Zr.Of 70 known metallic elements, only about 30 have been electrodeposited from aqueous solution. Many of the metals which have not been deposited would have useful applications if they could be obtained in the form of coatings or electroformed into objects. Several of these metals are of considerable current interest, namely, Ti, Zr, Mo, Ta, and W. Since a majority of the metals could not be deposited from aqueous solution, electrochemists turned their attention to nonaqueous media. These are of two types: fused salts, and compounds which are liquid at ordinary temperatures.Practically all metals can be deposited from fused electrolytes. However, electrodeposition from fused electrolytes has not solved the problem of obtaining coherent coatings of these metals, because, with the few exceptions noted below, the deposits are obtained in the form of powders, crystals, sponges, or dendrites which are of no value as coatings. Metals in this form may, however, be of value for electrowinning purposes. From fused salt baths operated on a laboratory scale, coatings of Mo about 0.25 mm thick and coatings of Ti and A1 about 0.025 mm thick have been obtained, but thus far no commercially successful process has been developed. Fused electrolytes are not discussed further in this paper.Those metals which can be deposited from aqueous solutions can also be deposited from nonaqueous media, but such plating solutions are at present of no practical importance. In the following discussions, to distinguish between those metals which can and those which cannot be deposited from aqueous solutions, the latter group is referred to as the nonaqueous or "NQ" metals. The following discussions apply only to the NQ metals, unless otherwise noted.Researches reported here deal with the use of organic solvents in plating baths. A nonaqueous plating bath which is liquid at room temperature has obvious advantages over a fused salt bath which must be operated at elevated temperatures. Some inorganic liquids, such as liquid NH3, liquid S02, and hydrazine, have been studied as media for depositing metals, but none of the NQ metals has been deposited from them; therefore, they are not considered further in this paper. Organic compounds which melt at a sufficiently low temperature, e.g., 100~ so that they can be handled with about the same ease as ordinary organic solvents may be considered as intermediate between fused salt baths and organic liquids. In contrast with the universality with which metals have been deposited from fused salt baths, few of the NQ metals have been deposited from organic solvents. Until recent years no satisfactory plating bath had been developed for depositing an NQ metal as a sound coati...

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Electrodeposition of Aluminum Alloys

Cited by 10 publications

References 0 publications

Nernst plots and formal potentials in a nonpolar solvent consisting of aluminum bromide (Al2Br6) and potassium bromide in ethylbenzene

Nernst plots and formal potentials in a nonpolar solvent consisting of aluminum bromide (Al2Br6) and potassium bromide in ethylbenzene

Electrodeposition of Aluminum‐Tin Alloys from Organic Electrolytes

Electrodeposition of Metals from Organic Solutions

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