Electrodeposition of Ag–Ni films from thiourea complexing solutions

Electrodeposition Approaches to Deposit the Single-Phase Solid Solution of Ag-Ni Alloy

“…The decrease of the reduction potential of Ag by adding additive of thiourea in the electrolytic solution is also reported by Liang et al [23]. They deposited Ag-Ni films on the Cu substrate by using thiourea-based acidic solutions as an electrolyte.…”

“…The electrodeposition method has established itself as a most suitable method for synthesis of single-phase Ag-Ni alloy films due to its time efficiency, cost-effectiveness, and ability to mass production of single-phase solid solutions [13,[20][21][22][23][24][25][26]. In the electrodeposition process, the apparatus used for the deposition of the film is less complicated than the vacuum-based methods such as molecular beam epitaxy or sputtering.…”

Influence of thiourea addition on the electrodeposition of ZnO from zinc nitrate aqueous solutions

“…In the case of eosin, the latter is adsorbed during the growth of ZnO and acts as a structure directing agent. Such a mechanism could also occur with thiourea which is a well known additive in metal and metal oxides electrodeposition [20], [21], [22], [23]. This molecule can adsorb on the substrate area and modify the growth process even blocking the active sites inhibiting .…”

Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

“…those that can be deposited individually and those that can be only codeposited. The former group consists of metals that are much nobler than Ni, like Ag [54][55][56][57] and Cu [58][59][60][61][62][63][64][65][66][67][68]; metals that have similar standard potentials, such as Co [69][70][71][72][73][74][75][76] and Sn [77][78][79][80][81][82][83][84][85]; and metals that are more cathodic, like Cr [86,87], Zn [88][89][90][91][92][93][94][95][96][97][98][99][100] and Mn [101]…”

“…The Ni inside the deposit increased with increasing the deposition time (and thus thickening the layer). The incorporation of Ni inside Ag seemed to happen due to kinetic trapping of Ni within the growing Ag; however, this process highly depends on the Ni:Ag ions ratio in the electrolyte[54].…”