Electrodeposition mechanism and characterization of Ni–Cu alloy coatings from a eutectic-based ionic liquid

Experimental investigation and thermodynamic calculations of the Cu–In–Ni phase diagram

“…On the other hand, nickel substrates are massively applied in electronic devices [6]. Moreover, there is a significant and increasing interest in Ni-Cu alloys [7][8][9][10] which is related to their good corrosion resistance [11][12][13][14], mechanical [15][16][17], magnetic [18,19] and optical properties [20]. Because of the expressed dynamic activity of Ni-Cu systems, their role as efficient and chemically stable catalysts is of growing interest [21][22][23] as well.…”

Immersion gold deposition from a chloroauric acid–choline chloride solution: Deposition kinetics and coating performances

“…Choline chloride (2-hydroxyethyl)trimethylammonium chloride, ChCl) as a quaternary ammonium salt is widely applied to metal [8] and alloy electrodeposition [9][10][11][12][13][14][15][16][17][18][19] in the form of deep eutectic solvents (DESs) [20][21][22]. However, relatively low attention was received in metal electroless deposition from ChCl-based DESs [23,24].…”

Electrochemical deposition and microstructural characterization of AlCrFeMnNi and AlCrCuFeMnNi high entropy alloy thin films

“…This simple method provides the possibility of depositing thin films on substrates with a complex geometry and it can be carried out at low processing temperatures and with low energy consumption. Electrodeposition allows an easy control of Currently, non-aqueous solvents are the best alternative for the electrodeposition of metals and alloys, due to their characteristics: good chemical and thermal stability, high electrical conductivity, wide working temperature range and most importantly, wide electrochemical windows, no hydrogen evolution and hydroxide generation [17][18][19].…”