Electrodeposition behavior of noble metals in ordered macroporous silicon

Abstract

Electrodeposition of noble metals (Pt, Pd, and Au) in ordered macropores prepared in p‐type Si under dark condition was investigated. Pt deposition proceeded continuously from the pore bottoms, and ordered micro‐rods were obtained. Pd deposition proceeded on the whole pore walls, and discontinuous micro‐tubes were obtained. Au deposition proceeded at 10‐20 μm depth from the pore openings where a high immersion plating rate was observed without applied potential, and short micro‐rods were obtained. At the pore bottoms a small amount of deposition was observed. The different behaviors of electrodeposition depending on the metals were compared and discussed. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

Gold electrodeposition into porous silicon: Comparison between meso‐ and macroporous silicon

“…A previous study suggests that nucleation resulting from displacement deposition influences the behavior of electrodeposition [6]. In our case the displacement deposition occurs during the set-up preparation, before the beginning of current flow.…”

“…In recent reports [6][7][8], we studied the electrodeposition of noble metals Pt, Pd, and Au into ordered macroporous Si and those of Cu into mesoporous Si. However after the investigations, we could not uniformly fill Au into the macroporous template.…”

“…The deposition reaction spontaneously proceeds when porous Si is immersed in a solution containing metal ions although the deposition rate often depends on the potential of an electrodeposition reaction [6]. In order to examine the deposition by displacement reaction, the specimen was immersed in 0.05 M HAuCl 4 + 0.42 M Na 2 S 2 O 3 + 0.42 M Na 2 SO 3 for 1 h in the dark.…”

Pulse Electrodeposition of Palladium Nanoparticles onto Silicon in DMSO

“…By varying the electrolyte composition, the values of the cathodic potential or current density, and the methods of current supply (stationary, cyclic, and pulsed), it is possible to obtain MNPs of various shapes and sizes on the silicon surface. Most of the studies on electrochemical production of MNPs/Si surface systems have been performed in aqueous solutions (see Table 1) [9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28]. However, the water factor as a medium does not always provide the ability to control the geometry of MNPs at the main stages of their formation: cathodic reduction (1), nucleation, i.e., formation of metal nanoclusters (MNCs) (2), and nanoparticles (3).…”

Electrodeposition of platinum and silver into chemically modified microporous silicon electrodes

“…Such properties are advantageous to the preparation of metal/semiconductor hybrid materials and catalyst-dispersed porous structures. However, there is a difficulty in metal electrodeposition within porous silicon that plugging often occurs before it is fully and/or homogeneously filled with metal [ 1 - 4 ]. Inhibition of plugging during metal deposition is indispensable for controlling the filling of metal by electrodeposition.…”