The control of interfacial microstructural stability is of utmost importance to the reliability of liquid solder interconnects in high temperature electronic assemblies. This is primarily due to excessive intermetallic compounds (IMCs) that can form and continuously grow during high temperature operation, which renders conventional barrier metallizations inadequate. With the intention of reducing such excessive IMC growth, electrically conducting, NbO x containing Ni coatings were developed using electrodeposition and were assessed as solder diffusion barrier layers in terms of their electrical conductivity and barrier property. The present work adopts a novel electrochemical route to produce Ni-NbO x composite coatings of good uniformity, compactness and purity, from nonaqueous glycol-based electrolytes consisting of NiCl 2 and NbCl 5 as metal precursors. The effects of cathodic current density and NaBH 4 concentrations on the surface morphology, composition and thickness of the coatings were examined. Increased NaBH 4 concentrations were found to elevate the maximum deposit thickness (above 10 μm), although these led to a reduction in the co-deposited Nb content. The composite coatings generally exhibited good electrical conductivity. The reaction between a liquid 52In-48Sn solder and Ni-NbO x , with Nb contents up to 6 at.%, was studied at 200 • C. The results indicate that, Ni-NbO x with sufficient layer thickness and higher Nb content, offered longer service lifetime. Nb enrichment was generally observed at or close to the reaction front after high temperature storage which suggests evident effectiveness of the enhanced diffusion barrier characteristics. For electronic assemblies operated in high temperature environments such as those in aero-engine, oil well and geothermal drilling applications, the high operating temperatures (usually above 200• C) far exceed the conventional design limits (up to 125• C) of consumer electronic products and have resulted in a demand to generate more confidence in the performance and reliability of the solder interconnects. This is mainly due to strain hardening induced in the solder joints under the combined high temperature and mechanical vibration, leading to premature joint failure. The concept of a "liquid solder joint" has been put forward, 1,2 which utilizes a solder (e.g. Sn-In) with a melting point below the operation temperature, whereby the regular re-melting of the solder during the service life can effectively remove any accumulated thermal stress and associated progressive deterioration of the solder properties. However, the accelerated formation and growth of undesirable Sn-Cu intermetallic compounds (IMCs) at the interface between the Sn-based solder and Cu-based component has posed a considerable threat to the joint reliability as they tend to instigate brittle failure. This has rendered the conventional solder barrier metallizations (e.g. electrolytic Ni 3 and electroless Ni-P 4 ) inadequate. A 1 μm thick Nb metal layer has been found to be a promising rep...