2014
DOI: 10.1016/j.electacta.2013.12.094
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Electrodepositing Nickel under Electrolyte Reduced-pressure Boiling Condition

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Cited by 12 publications
(5 citation statements)
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“…Literature sources indicate that the performance of any electrochemical reaction in both high and reduced pressure results in modifications in microstructural topography with an enhancement in adhesive strength towards the substrate, superior uniformity and compactness of coatings, reduction in pits and cracks 114 , refined grains and control over crystal orientation 144,145 . The experimental parameters employed under various reports are indicated in Table 5.…”
Section: Influence Of Electrolytic Pressure and Cell Atmospherementioning
confidence: 99%
“…Literature sources indicate that the performance of any electrochemical reaction in both high and reduced pressure results in modifications in microstructural topography with an enhancement in adhesive strength towards the substrate, superior uniformity and compactness of coatings, reduction in pits and cracks 114 , refined grains and control over crystal orientation 144,145 . The experimental parameters employed under various reports are indicated in Table 5.…”
Section: Influence Of Electrolytic Pressure and Cell Atmospherementioning
confidence: 99%
“…System of the vacuum boiling electrodeposition process (a) [166] and schematic mechanism of surface-boiling electrodeposition in the vacuum boiling electroforming process (b) [21]. Reprinted from [166], Copyright (2014), with permission from Elsevier. Reprinted from [21], Copyright (2012), with permission from Elsevier.…”
Section: Electrochemical Wet Stampingmentioning
confidence: 99%
“…Reprinted from [21], Copyright (2012), with permission from Elsevier. Evolution process of a boiling gas bubble formed under the conditions of reduced pressure during nickel electrodeposition [166]. Reprinted from [166], Copyright (2014), with permission from Elsevier.…”
Section: Electrochemical Wet Stampingmentioning
confidence: 99%
“…Voids were found in the core of the microstructures with lateral feature sizes smaller than 70 µm, due to a restricted mass transfer in the microcavities of the mold. However, it is believed that microstructures with finer feature sizes and higher aspect ratios can be achieved by further improvements in microscale mass transfer, such as ultrasonic microelectroforming [35], jet electrodeposition [36], microelectroforming under boiling conditions [37], and pulsed current microelectroforming [38].…”
Section: Feature Sizementioning
confidence: 99%