2018
DOI: 10.1016/j.jallcom.2017.11.040
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Electrodeposited Cu/buckypaper composites with high electrical conductivity and ampacity

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Cited by 19 publications
(17 citation statements)
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“…30 cm) could be deposited without a sample holder, simply by gluing a small piece of PVC plastic at the bottom of the yarn to hold the sample straight in an otherwise similar setup. The electrolytes used in electrochemical deposition were aqueous based copper sulfate baths in similar concentrations as often applied in electrodeposition of copper on carbon materials and in industrial electroplating (Paunovic & Schlesinger, 2006;Sundaram et al, 2017a;Tao et al, 2017;Chen et al, 2018a;Kim et al, 2018). The following electrochemical deposition electrolytes were used: Electrolyte I: 0.8 M CuSO4•5H2O and 0.4 M H2SO4 (Publication I) Electrolyte II: 0.6 M CuSO4•5H2O, 0.8 M H2SO4 and 0.1mM NaCl (Publication II) Electrolyte III: 0.6 M CuSO4•5H2O and 0.9 M H2SO4 (Publication III) Electrolyte IV: 0.1 M CuSO4•5H2O, 3 M H2SO4, 1.0 mM NaCl and industrial accelerator CG 2001 Additive (Shipley) 0.8 ml/l Galvanostatic deposition (Publication I, II and III) and potentiostatic oxidation (Publication III) techniques were utilized in production of CNT-Cu composites.…”
Section: Electrochemical Cell Set Up and Methodsmentioning
confidence: 99%
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“…30 cm) could be deposited without a sample holder, simply by gluing a small piece of PVC plastic at the bottom of the yarn to hold the sample straight in an otherwise similar setup. The electrolytes used in electrochemical deposition were aqueous based copper sulfate baths in similar concentrations as often applied in electrodeposition of copper on carbon materials and in industrial electroplating (Paunovic & Schlesinger, 2006;Sundaram et al, 2017a;Tao et al, 2017;Chen et al, 2018a;Kim et al, 2018). The following electrochemical deposition electrolytes were used: Electrolyte I: 0.8 M CuSO4•5H2O and 0.4 M H2SO4 (Publication I) Electrolyte II: 0.6 M CuSO4•5H2O, 0.8 M H2SO4 and 0.1mM NaCl (Publication II) Electrolyte III: 0.6 M CuSO4•5H2O and 0.9 M H2SO4 (Publication III) Electrolyte IV: 0.1 M CuSO4•5H2O, 3 M H2SO4, 1.0 mM NaCl and industrial accelerator CG 2001 Additive (Shipley) 0.8 ml/l Galvanostatic deposition (Publication I, II and III) and potentiostatic oxidation (Publication III) techniques were utilized in production of CNT-Cu composites.…”
Section: Electrochemical Cell Set Up and Methodsmentioning
confidence: 99%
“…These factors play a key role in how such a structure, including different types of fibers, yarns and films, will be wetted by the electrolyte when immersed in the electrochemical cell. Different authors attempt to overcome the issue of non homogeneous deposition of CNT material by various methods including using additives in aqueous electrolytes (e.g., Tao et al (2017)), using organic electrolytes (e.g., Subramaniam et al 2013;Sundaram et al 2018), oxidizing the CNT material before deposition (e.g., Publication III, Chen et al (2018a)) and utilizing very low deposition current density (e.g., Publication I-III, Subramaniam et al (2013); Tao et al (2017); Sundaram et al (2018)).…”
Section: Electrodeposition Of Coppermentioning
confidence: 99%
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