2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) 2012
DOI: 10.1109/nems.2012.6196848
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Electrode design optimization of a CMOS fringing-field capacitive sensor

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“…Many applications, however, utilize a planar electrode configuration where the electrodes are arrayed as parallel fingers on a nonconductive substrate [20][21][22]. Another electrode configuration for fringing field sensing is a two-dimensional array of metal electrode islands [23]. Rigid printed circuit board (PCB) technology has recently been demonstrated for realizing low-cost, small or large area, capacitive fringing field sensors where an FR-4 laminate was used as the rigid nonconductive substrate.…”
Section: A Capacitive Fringing Field Sensing Structuresmentioning
confidence: 99%
“…Many applications, however, utilize a planar electrode configuration where the electrodes are arrayed as parallel fingers on a nonconductive substrate [20][21][22]. Another electrode configuration for fringing field sensing is a two-dimensional array of metal electrode islands [23]. Rigid printed circuit board (PCB) technology has recently been demonstrated for realizing low-cost, small or large area, capacitive fringing field sensors where an FR-4 laminate was used as the rigid nonconductive substrate.…”
Section: A Capacitive Fringing Field Sensing Structuresmentioning
confidence: 99%