Electrochemical study of the activating solution for electroless plating of polymers

Abstract

This paper presents an electrochemical study about the activating solutions of the electroless plating of polymers, containing Pd(II), Sn(II) and Sn(IV) mixtures in HCl as main components. The objective of the study is the voltammetric characterization of these solutions by cyclic and linear voltammetry in order to study the recovery of tin and palladium from these solutions. The effect of concentration and rotation rate on the currentÀpotential curves was studied using the RDE technique. The electrochemical behaviour of solutions prepared in the laboratory was performed as a prior step to the further study of real activating rinsing solutions. The electrochemical reduction of Pd(II) takes place in two one-electron transfer steps which are mass transport controlled. The electrochemical reduction of Sn(II) and Sn(IV) is also mass transport controlled and takes place with direct formation of metallic tin, although the electrochemical reduction of Sn(IV) only takes place in solutions with HCl concentrations higher than 1 M. The presence of additives in the real solutions prevent the chemical reduction of Pd(II) and the formation of Sn(IV) hydroxylated complexes. This causes the appearance of well defined diffusion waves attributable to the electrochemical reduction of Pd(II) and Sn(IV). Hence, the recovery of both species simultaneously as well as separately could be carried out, if appropriate conditions are selected.

Electrochemical recovery of zinc from the spent pickling baths coming from the hot dip galvanizing industry. Potentiostatic operation

“…However, a previous study of the chemical and electrochemical behaviour of the metal ions must be done in order to examine the kinetic characteristics for the desired reactions and to take account of complexation of the cations and the irreversible nature of the electrodeposition processes [6].…”

Application of thermogravimetry in the assessment of coatings ability to be metallized

“…Metallized polymers are frequently used in many fields of technology including manufacturing of electronic integrated circuits, equipment for cars, airplanes and ships. Dynamic development of electronic devices, ongoing demands for their miniaturization as well as other requirements of modern technology constitute an important stimulus for conducting basic and experimental researches in the field of polymer metallization [5][6][7][8]. In electronics, physical (PVD) or chemical (CVD) vapour depositions of thin metallic films on the polymer substrate are mainly applied [9][10][11].…”

Copper nanoparticles seeded functionalized‐PVC plastic surface for electroless nickel deposition

“…Traditionally, three steps involving surface functionalization, activation and deposition are essential to the electroless deposition on nonmetallic substrates, and the preparation of catalytic nuclei on inert surface is prerequisite for the subsequent electroless deposition. The conventional activation process mainly contains ‘two‐step’ or ‘one‐step’ activation . However, a major problem still existed in commercialization, like the inevitable use of highly toxic Sn.…”

“…The conventional activation process mainly contains 'two-step' or 'one-step' activation. [12][13][14] However, a major problem still existed in commercialization, like the inevitable use of highly toxic Sn. Though a Sn-free process was used to address this concern in our previous work, [15] the high cost palladium is employed as the catalytic nuclear to initiate the electroless deposition.…”