2004
DOI: 10.1016/j.jelechem.2004.02.014
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Electrochemical quartz-crystal microbalance study of silver and copper electrodeposition on bare and iodine-covered platinum electrodes

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Cited by 9 publications
(6 citation statements)
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References 38 publications
(57 reference statements)
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“…Stripping voltammetry of silver nanoparticles, in dissolution in an electrolyte solution, was carried out using a 25 µm diameter platinum ultramicroelectrode. To detect silver (I) electrochemically at low concentrations, it is necessary to electro-deposit silver onto the electrode surface in a pre-concentration step by holding the potential of the electrode at −0.3 V versus Ag/AgCl for 60 s [18]. This procedure reduces Ag + to Ag 0 , which plates onto the electrode surface.…”
Section: Methodsmentioning
confidence: 99%
“…Stripping voltammetry of silver nanoparticles, in dissolution in an electrolyte solution, was carried out using a 25 µm diameter platinum ultramicroelectrode. To detect silver (I) electrochemically at low concentrations, it is necessary to electro-deposit silver onto the electrode surface in a pre-concentration step by holding the potential of the electrode at −0.3 V versus Ag/AgCl for 60 s [18]. This procedure reduces Ag + to Ag 0 , which plates onto the electrode surface.…”
Section: Methodsmentioning
confidence: 99%
“…Thus, it has been often utilized for the in situ analysis of plating, corrosion, modified electrodes, and chemical sensors. [18][19][20][21][22][23][24] The frequency change related to the mass change ͑⌬m͒ in the quartz crystal electrode, ⌬f m , is expressed by the Sauerbrey equation 25…”
Section: Theorymentioning
confidence: 99%
“…In the case of silver, the cyclic voltammogram of the coated electrode in supporting electrolyte is very simple, showing one deposition and one stripping process in the negative-and positivegoing sweeps, respectively. For copper, the presence of the iodine layer mediates interactions between the analyte and the electrolyte to a lesser extent due to both the formation of copper islands on the surface and the interaction between the copper and the halogen film [46].…”
Section: Resultsmentioning
confidence: 99%