Electrochemical Photocapacitance Spectroscopy: A New Method for Characterization of Deep Levels in Semiconductors

Haak, R.; Ogden, C.; Tench, D.

doi:10.1149/1.2123996

Cited by 25 publications

(19 citation statements)

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“…A variety of techniques based on AC impedance have been developed to study semiconductors. For example, Haak et al (1982Haak et al ( , 1984 and Haak and Tench (1984a, b) describe the use of electrochemical photocapacitance spectros- (1983) copy in which the capacity of a reverse-biased electrode is measured as a function of the wavelength of incident sub-bandgap light. Heller et al (1978) discuss two-beam photocurrent spectroscopy used for semiconducting electrodes where a chopped light beam of a given frequency is superimposed on a constantintensity beam of another frequency.…”

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confidence: 99%

A mathematical model for the AC impedance of semiconducting electrodes

Bonham

Orazem

1988

AIChE Journal

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A mathematical model is developed to calculate the impedance response of a semiconductor electrode to a sinusoidal current perturbation. The model accounts explicitly for electron and hole transport as well as generation and recombination through band-to-band mechanisms and through bulk interband electron acceptors of specified energy. The resistive (real) component of the impedance is shown to be sensitive to the concentration, distribution, and energy level of the bulk sites. The capacitive (imaginary) component, while useful for determining the dopant level and the flat-band potential of the semiconductor, is relatively insensitive to low concentrations of bulk sites.

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A mathematical model for the AC impedance of semiconducting electrodes

Bonham

Orazem

1988

AIChE Journal

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“…Tench and Ogden and their colleagues pioneered in the use of cyclic voltammetry stripping (CVS) [173][174][175][176][177]. They were also instrumental in using CVS with copper pyrophosphate solutions; this is covered later in this chapter.…”

Section: Methodsmentioning

confidence: 99%

Electrodeposition of Copper

Dini

Snyder

2010

Modern Electroplating

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Polyethylene oxides, glycols, and amines U.S.5,024,736 6/18/91 Clauss et al. Disubstituted ethane sulfonic compounds U.S.4,990,224 2/5/91 Mahmoud Urea, sodium lauryl sulfate, and tosyl or mesyl sulfonic acid U.S.4,975,159 12/4/90 Dahms Alkoxylated lactam amides U.S.4,954,226 9/4/90 Mahmoud Urea and glycerin U.S.4,948,474 8/14/90 Miljkovic Alkylarylene U.S.4,897,165 1/30/90 Bernards et al. Copper/sulfuric acid ratios U.S.4,781,801 11/1/88 Frisby Polyether surfactants þ sulfurized benzene þ grain refiner U.S.4,673,467 6/16/87 Nee Polyethers þ mercaptoimidazole þ sulfurized benzene U.S.4,555,315 11/26/85 Barbieri et al. Polyethers þ organic divalent sulfur compound þ tertiary alkyl amine with polyepichlorohydrin U.S.4,551,212 11/5/85 Rao et al. Phenazine dyestuffs U.S.4,540,473 11/22/83 Bindra et al. S-containing anions other than SO 4 U.S.4,521,282 7/11/84 Tremmel Sulfamic acid U.S.4,490,220 12/25/84 Houman Nitrogen-carbon-sulfur compound U.S.4,430,173 2/7/84 Boudot et al. Sodium salt of W-sulfo-n-propyl N,N-diethyldithiocarbamate, PEG, and crystal violet U.S.4,376,685 6/24/81 Watson Alkylated polyalkyleneimine U.S.4,347,108 8/31/82 Willis Nitrogen-and sulfur-containing compounds U.S.4,336,114 6/22/82 Mayer et al. Phthalocyanine, tertiary alkyl amine with polyepichloro hydrin, polyethyleneimine U.S.4,334,966 12/2/81 Beach et al. Polyether, mercaptoimidazole, sulfurized benzene U.S.4,310,392 1/12/82 Kohl Phenolphthalein U.S.4,272,335 2/19/80 Combs Substituted phthalocyanine radical U.S.4,242,181 12/30/80 Malak Regular coffee U.S.4,134,803 1/16/79 Eckles et al. Disulfides, sulfonic acids, and aliphatic aldehyde U.S.4,110,176 8/29/78 Creutz et al.

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“…Additive concentrations must be maintained within a specific range for best results. Techniques used for monitoring additive concentrations include cyclic voltametric stripping (CVS) [47][48][49][50][51][52][53], polarography [54], and other electrochemical methods. The method used must be able to detect the active species in the presence of degraded nonactive material and/or impurities.…”

Section: Electrochemical Analysismentioning

confidence: 99%

Monitoring and Control

Ritzdorf

2010

Modern Electroplating

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To obtaining quality deposits it is important to monitor and control electrochemical deposition (ECD) processes. This is also essential for an automatic plating system designed to minimize operator attention to production operations. A skilled and knowledgeable operator can maintain a reasonable plating quality with little supporting equipment. However, trends to more automation to reduce costs with higher processing speeds, application of plating to higher value products, and assurance of quality plating make it necessary to utilize many monitoring and control facilities.Electroplating process results are dependent on process stability and control and on the chemical composition of the plating bath. This makes it important to monitor the concentration of the various species in the bath. At a minimum, it is usually important to monitor the concentration of the metal ions and the supporting electrolyte. It may also be necessary to monitor constituents that interact in trace amounts or organic additives that modify the behavior of the process.Electroless plating, as described elsewhere, is an autocatalytic process initiated by a catalyst such as palladium and then catalyzed by the deposited metal itself [1]. Electrochemically, the system is quasi-stable, as it must be to work. This necessitates a closer control of bath chemistry than that required for electroplating solutions. Frequent electroless bath analysis and maintenance are necessary, especially when fast plating is involved, due to the speed with which the chemistry changes. Fast electroless metal deposition or poor bath control can result in spontaneous bath decomposition, causing metal particles to form and strip the solution of all metallic ions. Manual bath sampling and analysis are often not practical. Machines have been developed which automatically take samples and analyze and reconstitute the bath chemistry [2]. These will be discussed in Section 25.2.11. This chapter has three sections: process monitoring, bath constituent concentration monitoring and replenishment, and product monitoring. The first section focuses on sensors and techniques for monitoring the plating and associated processes and how to use these to increase the automation level of plating equipment. Because the concentration monitoring and control of chemistries used in the plating processes are so important and may be handled by equipment separate from the electroplating equipment in some cases, these topics are given their own section. Finally, a short section on product monitoring and quality control is included, although the reader should understand that product monitoring should be dictated more by the product requirements than by the process used to produce it. This section is meant merely as a reference to some of the common monitoring methods in use and how they are applied to control plating processes. PROCESS MONITORINGPlating processes, whether electrolytic or electroless, are utilized for many varied purposes. These may be for the manufacture of simple and cheap parts o...

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Electrochemical Photocapacitance Spectroscopy: A New Method for Characterization of Deep Levels in Semiconductors

Abstract: not Available.

Cited by 25 publications

References 16 publications

A mathematical model for the AC impedance of semiconducting electrodes

A mathematical model for the AC impedance of semiconducting electrodes

Electrodeposition of Copper

Monitoring and Control

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