Electrochemical modification of Bi2S3 coatings in a nickel plating electrolyte

EQCM study of electrochemical modification of Bi2S3 films in the Zn2+-containing electrolyte

“…This technique has been widely used for investigation of electrochemical deposition of binary [28][29][30][31][32][33][34] or ternary chalkogenides [35][36][37]. In our previous publications [23][24][25] we used the bismuth sulfide film as an activator for direct Ni deposition. The reaction mechanism of electroreduction of bismuth sulfide film was investigated in both the nickel plating solution and supporting ones in more detail using EQCM [24,25].…”

“…In our previous publications [23][24][25] we used the bismuth sulfide film as an activator for direct Ni deposition. The reaction mechanism of electroreduction of bismuth sulfide film was investigated in both the nickel plating solution and supporting ones in more detail using EQCM [24,25]. The study of the reduction of bismuth sulfide coating in Watts nickel plating electrolyte shows that the observed increase in coating mass under the potential region close to the equilibrium potential of the Ni/Ni 2+ system is conditioned by Ni 2+ ions reduction before the bulk deposition of Ni, initiated by Bi 2 S 3 [24].…”

“…The reaction mechanism of electroreduction of bismuth sulfide film was investigated in both the nickel plating solution and supporting ones in more detail using EQCM [24,25]. The study of the reduction of bismuth sulfide coating in Watts nickel plating electrolyte shows that the observed increase in coating mass under the potential region close to the equilibrium potential of the Ni/Ni 2+ system is conditioned by Ni 2+ ions reduction before the bulk deposition of Ni, initiated by Bi 2 S 3 [24]. After the modification of bismuth sulfide film in the nickel plating electrolyte at E = À0.3 V (SHE) the sheet resistance of the layer decreases from 10 13 X cm to 500-700 X cm.…”

“…Bismuth sulfide films have also been proposed for direct metallization of dielectrics [13]. Successful direct metallization onto modified insulating polymer surfaces or electrically conductive substrates has been proposed using zinc sulfide [14], cobalt sulfide [15][16][17][18][19][20][21], nickel sulfide [22] and bismuth sulfide [23][24][25] as activators. Most commonly, an appropriate metal sulfide layer is deposited on a non-conductive surface using the successive ionic adsorption and reaction (SILAR) method.…”

EQCM study on the oxidation/reduction of bismuth sulfide thin films

“…This technique has been widely used for investigation of electrochemical deposition of binary [1][2][3][4][5][6][7][8][9] or ternary chalkogenides [10][11][12]. In our previous publications [13][14][15][16] we studied the electroreduction of bismuth sulfide layers deposited on gold and glassy carbon (GC) electrodes in both the metal plating solutions as well as in the supporting ones. It was shown that the bismuth sulfide can be easily modified in nickel and zinc plating electrolytes.…”