Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

Zou, Shiwen; Li, Yong; Dong, Chaofang; Ding, Kangkang; Xiao, Kui

doi:10.1016/j.electacta.2013.10.051

Cited by 61 publications

(19 citation statements)

References 38 publications

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“…It was found that only the presence of mild dust at low levels resulted in ECM. Zou et al 147 studied the ECM of Sn-37Pb solder alloy in trace amount (1 ppm) of H 2 S condition at 20 C and 40% RH.…”

Section: Other Contaminantsmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

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Section: Other Contaminantsmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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“…A saturated calomel electrode (SCE) as RE was placed into the tube from one end. In the previous work [9][10][11][12], a two-electrode system consisting of WE and CE was usually used in the ECM test, trying to simulate the operating condition of electronics. However, the exact potential applied on the working electrode was missing.…”

Section: Materials and Setup For Electrochemical Migration Testmentioning

confidence: 99%

Evidence for Ag participating the electrochemical migration of 96.5Sn-3Ag-0.5Cu alloy

Zhong

Liao

et al. 2019

Corrosion Science

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Ag participating the electrochemical migration (ECM) of SnAg based alloys is still controversial. In this work, Ag + concentration in electrolyte layer and Ag distribution in dendrites formed during the ECM of 96.5Sn-3Ag-0.5Cu alloy were investigated using Inductively Coupled Plasma Source Mass Spectrometer and Scanning Transmission Electron Microscopy, respectively. The results show that Ag + can be detected in electrolyte layer when the anodic polarization potential applied on the 96.5Sn-3Ag-0.5Cu alloy is high enough. Under such a condition, Ag could also be found in dendrites. Therefore, it can be concluded that Ag participates the ECM of 96.5Sn-3Ag-0.5Cu alloy, but it is potential-dependent.

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“…However, within the scope of its usual application thickness, it is easy to cause microporous corrosion [ 8 ]. The corrosion behavior of gold-plated components is closely associated with relative humidity (RH), SO 2 [ 9 ], H 2 S [ 10 ], dust particles [ 11 , 12 ], molds, and other factors [ 13 , 14 ].…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

et al. 2017

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The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material) between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH) environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed.

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Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

Cited by 61 publications

References 38 publications

Electrochemical migration of Sn and Sn solder alloys: a review

Electrochemical migration of Sn and Sn solder alloys: a review

Evidence for Ag participating the electrochemical migration of 96.5Sn-3Ag-0.5Cu alloy

Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

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