Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board

Lee, Shin-Bok; Yoo, Young-Ran; Jung, Junhee; Park, Young-Bae; Kim, Young‐Sik; Joo, Young‐Chang

doi:10.1016/j.tsf.2005.09.022

Cited by 62 publications

(43 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…3 There are two main mechanisms by which ECM can cause electronic device failure: the formation of conducting anodic filament (CAF) and dendrite growth. [4][5][6][7][8][9][10] ECM occurs in electronic systems because, under certain environmental conditions such as high humidity, temperature, applied voltages, electrode materials, and variation impurities, 9,10 the leads are likely to become electrochemically unstable. The metal interconnects in an electronic device can respond to applied voltages by electrochemical ionization and conductive filament formation, which leads to short-circuit failure of the electronic device.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions

Jung

Lee

et al. 2008

Journal of Elec Materi

Self Cite

View full text Add to dashboard Cite

Anodic dissolution characteristics and electrochemical migration (ECM) behavior of Sn-3.0Ag-0.5Cu solder in NaCl and Na 2 SO 4 solutions were investigated using anodic polarization tests and water drop tests (WDT). The ECM lifetime of Sn-3.0Ag-0.5Cu solder in NaCl solution (42.4 s) was longer than that in Na 2 SO 4 solution (34.8 s). The pitting potential of Sn-3.0Ag-0.5Cu solder in NaCl solution (135 mV, SCE) was higher than that in Na 2 SO 4 solution (-367 mV, SCE). The passivity film (SnO 2 ) formed on Sn-3.0Ag-0.5Cu solder during WDTs in NaCl solution was thicker than that formed in Na 2 SO 4 solution. Therefore, the longer ECM lifetime of Sn-3.0Ag-0.5Cu solder in NaCl solution than in Na 2 SO 4 solution can be attributed to the higher pitting potential in the NaCl solution, which is ascribed to the formation of a thicker passivity film (SnO 2 ) in the former. It was confirmed that microelements such as Ag and Cu do not take part in ECM because they form chemically stable intermetallic compounds with Sn. We believe that Sn is the only element that contributes to ECM, and dissolution of Sn at the anode is possibly the ratedetermining step of ECM of Sn-3.0Ag-0.5Cu solder.

show abstract

Section: Introductionmentioning

confidence: 99%

Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions

Jung

Lee

et al. 2008

Journal of Elec Materi

Self Cite

View full text Add to dashboard Cite

show abstract

“…Two metal pads having the same composition are located on top of an insulating material. These two pads are connected to the terminals of a DC voltage supply [10,11]. An electrolyte is deposited across the two pads.…”

Section: Introductionmentioning

confidence: 99%

Influence of corrosion properties on electrochemical migration susceptibility of SnPb solders for PCBs

Yoo

Kim

2007

Met. Mater. Int.

View full text Add to dashboard Cite

Electrochemical migration is caused by the adsorption of water and the bias voltages between the electrodes or pads which form an electric circuit or in the solders used to connect the parts. This work focused on the elucidation of the mechanisms of electrochemical migration of pure Sn, Sn37Pb, and Sn55Pb solders in electronics. The electrochemical migration behavior was discussed on the basis of the polarization behavior of SnPb solders. After the water drop test, the time to failure decreased with increasing Pb content in Cl solution and increased with increasing Pb content in SO 4 2 solution. In the case of the SnPb solder alloys, the pitting potential, the passive current density, the cathodic current density and the efficiency of cathodic deposition of the alloying elements were closely related to the resistance of the electrochemical migration.

show abstract

“…Takemoto et al 76 reported that in pure water pure Pb showed the highest susceptibility of ECM, thereby the addition of Pb increased the susceptibility, and Sn had the lowest susceptibility compared to that of Pb and Sn-40Pb solder alloy. Lee et al 82 investigated the ECM characteristic of Sn-Pb solder alloys with varying DC bias voltages under 85 C and 85% RH condition. They found that Pb was more susceptible to ECM failure than Sn in the eutectic Sn-Pb solder alloys.…”

mentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

View full text Add to dashboard Cite

Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

show abstract

Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board

Cited by 62 publications

References 7 publications

Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions

Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions

Influence of corrosion properties on electrochemical migration susceptibility of SnPb solders for PCBs

Electrochemical migration of Sn and Sn solder alloys: a review

Contact Info

Product

Resources

About