Electrochemical Machining

Hoare, James P.; LaBoda, Mitchell A.

doi:10.1007/978-1-4684-3785-0_8

Cited by 8 publications

(4 citation statements)

References 134 publications

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“…Such a porous structure was expected to improve adhesion strength of the successive electroplated Cu layer to the substrate. [20]. They suggested that H 3 BO 3 in the Watts bath acted not only as a pH buffer but also as a homogeneous catalyst by forming a complex with Ni ions to lower the overvoltage for nickel deposition [21].…”

Section: Analysis Of the Zincating Processmentioning

confidence: 99%

Influence of zincate pretreatment on adhesion strength of a copper electroplating layer on AZ91 D magnesium alloy

Tang

Azumi

2011

Surface and Coatings Technology

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Cu was electrodeposited on AZ91 D Mg alloy with zincate pretreatment in an alkaline plating bath, and the effect of zincate pretreatment on adhesion strength of the Cu layer was investigated. Scanning electron microscopy results showed that Zn was mainly deposited on the α-phase surface, and ultrasonic agitation at the initial stage of the zincate pretreatment improved the coverage of the Zn layer even on the β-phase surface, resulting in enhancement of the adhesion strength of the Zn layer and the successive Cu layer to the substrate.Adhesion tests revealed that the plating layer peeled off at the mixed layer of Zn and Cu deposits formed at the interface between the zincated layer and the electrodeposited Cu layer.A smooth Cu surface was obtained in the plating bath containing H 3 BO 3 .

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Section: Analysis Of the Zincating Processmentioning

confidence: 99%

Influence of zincate pretreatment on adhesion strength of a copper electroplating layer on AZ91 D magnesium alloy

Tang

Azumi

2011

Surface and Coatings Technology

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“…An attack on the blocking layer by HF is also observed at metal electrodes (9). The high quantum efficiency for the photocurrent at p-type silicon shows that the surface coverage can also be decreased by electrons from the conduction band.…”

Section: Discussionmentioning

confidence: 92%

Silicon Etching in CrO3 ‐ HF Solutions: II . Low Ratios

Meerakker

Vegchel

1989

J. Electrochem. Soc.

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The dissolution of silicon in CrO3‐HF solutions with a low false[HFfalse]/false[CrO3false] ratio was investigated by etching and electrochemical measurements. Etching is seriously inhibited in comparison to solutions with a high ratio. The electrochemical measurements showed that inhibition is caused by the formation of a mixed valence chromium complex which partly blocks the surface. It has been found that a reaction between intermediates of both the reduction and the oxidation processes plays an important role in etching. A rate law for the etching kinetics is given.

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“…2, the current density decreased sharply after E Ni = ¹1.82 V. This is because pH in the vicinity of the working electrode increased due to hydrogen generation, and the Ni hydroxide formed on the working electrode surface acted as a resistive film. 24) In the CuNi alloy solution of No. 3, a single peak at about E CuNi = ¹0.13 V is seen, which corresponds to the reduction of Cu 2+ to metal Cu.…”

Section: Resultsmentioning

confidence: 99%

Formation of Cu–Ni Alloy Plating Film for Improving Adhesion between Metal and Resin

2022

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In the present study, plating films with three-dimensional structures were formed by using a plating bath mixed with Cu sulfate and Ni amidosulfate. Furthermore, the effect of the shape of plating films, which was changed by plating at different potentials, on the adhesive force with epoxy resin was investigated. The results show that when the ratio of the concentration of Ni amidosulfate to that of Cu sulfate was 150:15 (g/L) and the potential was set to ¹1.0 V to ¹2.0 V, dendritic plating films were formed. The average peak shear force of the specimen joined with epoxy resin between two Cu plates with the dendritic plating films formed at the potential of ¹1.5 V, was 180.1 N. The dendritic plating films had higher adhesive force than the smooth plating film through the anchoring effect.

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Electrochemical Machining

Cited by 8 publications

References 134 publications

Influence of zincate pretreatment on adhesion strength of a copper electroplating layer on AZ91 D magnesium alloy

Influence of zincate pretreatment on adhesion strength of a copper electroplating layer on AZ91 D magnesium alloy

Silicon Etching in CrO3 ‐ HF Solutions: II . Low Ratios

Formation of Cu–Ni Alloy Plating Film for Improving Adhesion between Metal and Resin

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