2022
DOI: 10.1016/j.actamat.2022.118018
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Electrochemical etching of p-type GaN using a tunnel junction for efficient hole injection

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Cited by 6 publications
(6 citation statements)
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“…For both BN layers, the refractive index for wavelengths above 500 nm may be treated as slowly varying, therefore the refractive index contrast is almost constant, at an average of 0.17. This value is on a similar level as the refractive index contrast of porous and non-porous GaN layers used in DBRs [34,35]. Furthermore, for this wavelength range, the imaginary part of the refractive index is negligible, therefore the layers may be treated as non-absorbing.…”
Section: Growing Bn Layers With High Refractive Index Contrastmentioning
confidence: 59%
See 1 more Smart Citation
“…For both BN layers, the refractive index for wavelengths above 500 nm may be treated as slowly varying, therefore the refractive index contrast is almost constant, at an average of 0.17. This value is on a similar level as the refractive index contrast of porous and non-porous GaN layers used in DBRs [34,35]. Furthermore, for this wavelength range, the imaginary part of the refractive index is negligible, therefore the layers may be treated as non-absorbing.…”
Section: Growing Bn Layers With High Refractive Index Contrastmentioning
confidence: 59%
“…Another approach to obtain the needed reflective index contrast is to use porous structures. However, such structures require a selective post-fabrication etching process [30][31][32][33][34][35].…”
Section: Introductionmentioning
confidence: 99%
“…The process consists, in most cases, of immersing the metal (or the semiconductor) in acid baths (electrolyte) during a specific time to create, first, porous nanostructures onto the substrate surfaces and, second, to enable the creation of a thin layer of metal oxide (by anodization) that protects and stabilizes the nanostructures [19,20]. By this, the surface area increases as the structure of the substrate is converted from 2D surfaces to 3D surfaces [123]. Conceptively, many parameters affect the process and should be controlled, e.g., the concentration of the acidic solutions, the temperature of the baths, the presence of a catalyst that has an essential role in the initiation of material nucleation (e.g., copper ions), and, finally, the thickness of the substrate.…”
Section: Surface Modificationmentioning
confidence: 99%
“…Pasayat et al reported the top-down porosity analysis of different matrices by transimission electron microscopy (TEM), which proved that consistent pore distribution is expected to achieve uniform stress relaxation on the sample surface [55]. Fiuczek et al reported that a p-type GaN controlled ECE method using tunnel junction as a cap is to ensure stable, efficient and controllable hole injection in p-type semiconductors [56].…”
Section: Development Of Np-ganmentioning
confidence: 99%