“…The process consists, in most cases, of immersing the metal (or the semiconductor) in acid baths (electrolyte) during a specific time to create, first, porous nanostructures onto the substrate surfaces and, second, to enable the creation of a thin layer of metal oxide (by anodization) that protects and stabilizes the nanostructures [19,20]. By this, the surface area increases as the structure of the substrate is converted from 2D surfaces to 3D surfaces [123]. Conceptively, many parameters affect the process and should be controlled, e.g., the concentration of the acidic solutions, the temperature of the baths, the presence of a catalyst that has an essential role in the initiation of material nucleation (e.g., copper ions), and, finally, the thickness of the substrate.…”