Electrochemical Deposition of Copper on a Gold Electrode in Sulfuric Acid: Resolution of the Interfacial Structure

Toney, Michael F.; Howard, Jason N.; Richer, Jocelyn; Borges, Gary L.; Gordon, Judith R.; Melroy, Owen R.; Yee, Dennis; Sorensen, L. B.

doi:10.1103/physrevlett.75.4472

Cited by 219 publications

(212 citation statements)

References 24 publications

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“…For the Au(111) surface this is a triangular lattice of threefold hollow sites [6]. The model is defined by the effective lattice-gas Hamiltonian,…”

Section: Lattice-gas Modelmentioning

confidence: 99%

Simulated Dynamics of Underpotential Deposition of Cu with Sulfate on Au(111)

Brown

Rikvold

Novotny

et al. 1999

J. Electrochem. Soc.

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Numerical studies of lattice-gas models are well suited to describe multi-adsorbate systems. One example is the underpotential deposition of Cu on Au(111) in the presence of sulfuric acid. Preliminary results from dynamic Monte Carlo simulations of the evolution of the adsorbed layer during potential-step experiments across phase transitions are presented for this particular system. The simulated current profiles reproduce a strong asymmetry seen in recent experiments. Examination of the microscopic structures that occur during the simulated evolution processes raises questions that need to be investigated by further experimental and theoretical study.

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“…For the Au(111) surface this is a triangular lattice of threefold hollow sites [6]. The model is defined by the effective lattice-gas Hamiltonian,…”

Section: Lattice-gas Modelmentioning

confidence: 99%

Simulated Dynamics of Underpotential Deposition of Cu with Sulfate on Au(111)

Brown

Rikvold

Novotny

et al. 1999

J. Electrochem. Soc.

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“…This is followed by formation of a ( 3× 3)R30°h oneycomb adlayer consisting of copper and coadsorbed sulfate or bisulfate in the potential region between two UPD peaks, and formation of a pseudomorphic (1×1) adlayer of the copper monolayer on Au(111) at potentials more negative than the second UPD peak (-0.420 V). 3,4,9,[15][16][17]20 To characterize kinetic parameters of the copper deposition onto the bare and copper monolayer coated Au(111) surface, we utilized two different starting potentials for our current transient measurements. They are marked as potentials A (-0.050 V) and B (-0.430 V) in Figure 1.…”

Section: Copper Deposition From 01 M H 2 So 4 (Ph 4)mentioning

confidence: 99%

“…Many aspects of both UPD and OPD processes have been described in great detail, including electrodeposition onto the Au(111) surface, the structure of the copper-UPD adlayer and its mechanism of formation, and the influence of different (coadsorbed) anions on UPD adlayer formation. 1,2 Recent progress in the field has made use of modern, in situ techniques for structural characterization such as STM, [3][4][5][6][7][8][9][10][11][12][13] in situ X-ray measurements, [14][15][16][17][18][19] in situ electrochemical quartz crystal microbalance studies, 20,21 and updated electrochemical studies. [22][23][24][25] Studies of copper OPD onto Au(111) have focused on determining deposit morphology, characterizing kinetics of the electronucleation process, and examining how different molecular additives influence the course of the deposition process.…”

Section: Introductionmentioning

confidence: 99%

New Insights into Evaluation of Kinetic Parameters for Potentiostatic Metal Deposition with Underpotential and Overpotential Deposition Processes

2000

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Kinetics of copper deposition onto an Au(111) surface from sulfuric acid electrolyte, was evaluated using potentiostatic current transients. Measurements were conducted employing a new and nontraditional method, with gold electrode completely free from copper deposit at the beginning of the potential step (i.e., deposition process). The current transients obtained clearly show partial contribution from copper underpotential deposition (UPD) and copper overpotential deposition (OPD) processes. Quantitative evaluation of experimental transients was performed with the recently developed method for theoretical transient computer simulation. Detailed analysis of the kinetic parameters shows that copper UPD could be characterized as a two-dimensional nucleation and growth limited by the lattice incorporation (2D-LI) process and copper OPD as a three-dimensional nucleation process limited by diffusion-controlled growth (3D-DC). The UPD seems to be an inevitable part of the deposition process and takes place prior to OPD, regardless of the potential applied. Therefore, UPD should be treated as an early stage of the deposition process. Furthermore, our results show that the kinetics differs depending on whether deposition is initiated from a clean, bare Au(111) surface or from a gold surface already coated with a copper UPD adlayer. This indicates the role of the UPD process and the UPD adlayer on the course of OPD. Differences observed in deposition kinetics between electrolytic baths at pH 2 and 4 were likely due to adsorption of different sulfate species (sulfate or bisulfate anions) on the copper-deposit-modified Au(111) substrate (UPD, epitaxial monolayer) or bulk deposit adlayer (OPD).

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“…[9,12] For these calculations, the root-mean-square displacement amplitude σ was taken as 0.14 Å. [5,13] The long-range order parameter measures the extent of chemical order and is given by…”

Section: Methodsmentioning

confidence: 99%

Stoichiometry--Anisotropy Connections in Epitaxial L10 FePt (001) Films

Barmak¹

2004

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found that the order parameter has a maximum for the film composition closest to the equiatomic composition, whereas the magnetocrystalline anisotropy increases as the Fe content is increased from below to slightly above the equiatomic composition. These results imply that non-stoichiometric FePt compositions, with a slight excess of Fe, may in fact be preferred for applications that require high anisotropy.

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Electrochemical Deposition of Copper on a Gold Electrode in Sulfuric Acid: Resolution of the Interfacial Structure

Cited by 219 publications

References 24 publications

Simulated Dynamics of Underpotential Deposition of Cu with Sulfate on Au(111)

Simulated Dynamics of Underpotential Deposition of Cu with Sulfate on Au(111)

New Insights into Evaluation of Kinetic Parameters for Potentiostatic Metal Deposition with Underpotential and Overpotential Deposition Processes

Stoichiometry--Anisotropy Connections in Epitaxial L10 FePt (001) Films

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