Electrochemical corrosion behaviour of Sn-Zn-xBi alloys used for miniature detonating cords

Abstract

Electrochemical corrosion behaviour of Sn-3Zn-xBi (x=0, 1, 3, 5, 7 wt.%) solder alloys were investigated using potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) techniques, to explore the effect of Bi on corrosion performance of the Sn-Zn alloy. Results indicated that minor (1 wt.%) Bi addition increased the corrosion susceptibility, mainly attributed to the coarsened and more uniformly distributed Zn-rich precipitates, while further increasing Bi decreased the corrosion susceptibility due to the higher fraction of nobler Bi particles serving as anodic barriers. The Sn-3Zn-7Bi possessed the best corrosion resistance among all alloys. The role of Bi on corrosion was considerably discussed.

Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt-% NaCl solution

“…This is consistent with the results reported by Liu et al [24]. It was found that Bi particles could act as an anodic barrier and effectively reduce the corrosion rate of Sn-Zn in 3.5 wt-% NaCl solution [25]. When In was added to Sn-9Zn, it could cause the microstructure segregation of Sn-9Zn alloy, and decrease the passive current density [26].…”

Enhancing Interfacial Reliability of Metal–Thermoplastic Hybrid Joints via Adding Carbon Fiber and Adjusting Welding Heat Input

“…It should be pointed out that the corrosion products were produced leading to further corrosion rather than protecting the bottom alloys. 29,30 With the potentiodynamic polarization curves scanning to point C, the measured potential rose sharply with an increment of current density, which was contributed to the breakdown of the corrosion product film. Due to oxygen evolution reactions, the Cl − within testing solution was absorbed into corrosion products and finally punched the nonprotective film.…”

“…Due to oxygen evolution reactions, the Cl − within testing solution was absorbed into corrosion products and finally punched the nonprotective film. 30 The detailed electrochemical parameters of studied PA6/ 6061 and CFRPA6/6061 joints in 0.5 M NaCl solution are carefully tabulated in Figure 5c and Table S4. The corrosion current density (i coor ) was gained by extrapolating the anodic Tafel region with the corrosion potential (E coor ) because of the ambiguous cathodic Tafel region.…”

“…The detailed electrochemical parameters of studied PA6/6061 and CFRPA6/6061 joints in 0.5 M NaCl solution are carefully tabulated in Figure c and Table S4. The corrosion current density ( i coor ) was gained by extrapolating the anodic Tafel region with the corrosion potential ( E coor ) because of the ambiguous cathodic Tafel region. , A higher i coor was assessed with the poorer corrosion resistance of the tested sample. As shown in Figure c, the corrosion current density of PA6/6061 was calculated to be 0.997 ± 0.053 μA·cm –2 .…”

Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO2 nanoparticles via vacuum melting process

“…As a consequence, to get a solution for that, others have concentrated on the manufacture and performance characterization of composite solders reinforced by various nanoparticles to lead-free solder alloys, while some authors have attempted to add trace alloying metals [16]. In view of that, alloying elements such as Bi [9,17], Ag, Cu [18], Ni [4,19,20], and other rare earth elements were selected as alloying additions to the Sn-Zn solder alloy in order to modify the composition. The added trace elements may form strong compounds by reaction with zinc [18], limiting its activity [21], reducing its melting point [10], and forming intermetallic compounds that enhancement the solder's mechanical properties [22].…”