Electrochemical characterization of Cu dissolution and chemical mechanical polishing in ammonium hydroxide–hydrogen peroxide based slurries

Venkatesh, R.; Ramanathan, Surash

doi:10.1007/s10800-009-0055-4

Cited by 9 publications

(3 citation statements)

References 46 publications

(79 reference statements)

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“…The pattern obtained in resistance variation matches well with the MRR resulted from CMP experiments. Kramers Kronig Transformation (KKT) is employed to check the electrochemical impedance data for stability, linearity and causality 25…”

Section: O N L I N E F I R S Tmentioning

confidence: 99%

Urea as a complexing agent for selective removal of Ta and Cu in sodium carbonate based alumina chemical–mechanical planarization slurry

Shukla

Selvam

Manivannan

2022

JSCS

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This work reports urea as a promising complexing agent in sodium carbonate (Na2CO3) based alumina slurry for chemical mechanical planarization (CMP) of tantalum (Ta) and copper (Cu). Ta and Cu were polished using Na2CO3 (1 wt.%) with alumina (2 wt.%) in the presence and absence of urea. The effect of slurry pH, urea concentration, applied downward pressure and platen rotational speed were deliberated and the outcomes were conveyed. Prior to the addition of urea, Ta removal rate (RR) was observed to enhance with pH from acidic to alkaline having maximum RR at pH 11. However, Cu RR decreases with increasing pH with minimum RR at pH 11. With the addition of urea in the slurry, Cu to Ta removal rate selectivity of nearly 1:1 is encountered at pH 11. The addition of urea boosts the Ta RR and suppresses Cu RR at the same time at 11 pH, as it adsorbs on the metal surface. Potentiodynamic polarization was conducted to determine the corrosion current (Icorr) and the corrosion potential (Ecorr). The electrochemical impedance spectroscopy (EIS) of both the metals was carried out in the proposed formulation and the obtained outcomes were elaborated.

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Section: O N L I N E F I R S Tmentioning

confidence: 99%

Urea as a complexing agent for selective removal of Ta and Cu in sodium carbonate based alumina chemical–mechanical planarization slurry

Shukla

Selvam

Manivannan

2022

JSCS

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“…Various studies have been conducted on modeling the reaction mechanisms with an equivalent circuit which is made up of resistors and capacitors alone (10,16,18,(20)(21)(22) The impedance data can be modeled by assuming an electrical circuit and obtaining the parameters by sequential regression or by parameter regression analysis (10,16,18,(20)(21)(22). An electrical equivalent circuit containing a constant phase element (CPE), capacitors in combination with resistors is considered for the impedance data analysis.…”

Section: Electrical Equivalent Circuit (Eec)mentioning

confidence: 99%

“…The EIS data show different patterns for different over potentials. Copper dissolution mechanism in various systems has been extensively studied (10)(11)(12)(13)(14)(20)(21)(22) . The simple direct dissolution model is given by…”

Section: Reaction Mechanism Analysismentioning

confidence: 99%

Analysis of Copper Dissolution in Glutamic Acid and Hydrogen Peroxide Using EIS

Ramanathan

Selvam

2011

ECS Trans.

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The dissolution of copper in solutions containing Glutamic acid and hydrogen peroxide is analyzed using EIS. Potentiodynamic polarization studies show that there is no strong passivating layer formed on the copper surface in solutions containing 0.5 wt% Glu and 0.1 vol% hydrogen peroxide. Electrochemical impedance spectra of copper in this solution at various overpotential were acquired and modeled using electrical equivalent circuit and reaction mechanism analysis. The results show that the reaction involves at least two adsorbed intermediates.

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Kinetics of carbon steel dissolution in ammonium chloride solution containing sodium thiosulfate

Baranwal

Rajaraman

2019

Int J of Chemical Kinetics

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The dissolution behavior of carbon steel in ammonium chloride (NH4Cl) solution containing sodium thiosulfate (Na2S2O3) of various concentrations (0.01 and 0.1 M) was investigated using electrochemical impedance spectroscopy (EIS) and other nonelectrochemical techniques. The weight loss and polarization measurements indicate a significant increase in the NH4Cl corrosion rate of carbon steel on addition of Na2S2O3. The EIS measurements exhibited two capacitive loops at multiple direct current (dc) potentials for both the concentrations. Electrical equivalent circuit (EEC) and reaction mechanism analysis (RMA) were employed to analyze the impedance data. A four‐step mechanism with two intermediate adsorbate species of same charge was proposed to explain the dissolution behavior of carbon steel in the given system. The surface coverage values enumerated that the surface was entirely covered with adsorbed species unlike in the pure NH4Cl system. Charge transfer resistance and polarization resistance values estimated from RMA parameters indicate the increase in a dissolution rate with dc potential. The surface morphology was inspected via field emission scanning electron microscopy, and the corrosion products including surface state of carbon steel electrode were analyzed using energy dispersive X‐ray spectroscopy and X‐ray photoelectron spectroscopy.

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Electrochemical characterization of Cu dissolution and chemical mechanical polishing in ammonium hydroxide–hydrogen peroxide based slurries

Cited by 9 publications

References 46 publications

Urea as a complexing agent for selective removal of Ta and Cu in sodium carbonate based alumina chemical–mechanical planarization slurry

Urea as a complexing agent for selective removal of Ta and Cu in sodium carbonate based alumina chemical–mechanical planarization slurry

Analysis of Copper Dissolution in Glutamic Acid and Hydrogen Peroxide Using EIS

Kinetics of carbon steel dissolution in ammonium chloride solution containing sodium thiosulfate

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