2022
DOI: 10.1016/j.matpr.2022.02.315
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Electrochemical behaviour of lead-free Sn-In-Al solders alloys in 3.5 wt.% NaCl solution

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Cited by 14 publications
(2 citation statements)
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“…From Fig. 11, it was evident that the corrosion products of Sn–0.7Cu– x Bi alloy after electrochemical corrosion exhibited diffraction peaks of Sn 3 O (OH) 2 Cl 2 phase in addition to SnO and SnO 2 phases, consistent with the results findings of Jaiswal et al 28 The chemical reaction equation is as follows: 29,30 3Sn + 4OH − + 2Cl − = Sn 3 O(OH) 2 Cl 2 + H 2 O + 6e − …”
Section: Resultssupporting
confidence: 85%
“…From Fig. 11, it was evident that the corrosion products of Sn–0.7Cu– x Bi alloy after electrochemical corrosion exhibited diffraction peaks of Sn 3 O (OH) 2 Cl 2 phase in addition to SnO and SnO 2 phases, consistent with the results findings of Jaiswal et al 28 The chemical reaction equation is as follows: 29,30 3Sn + 4OH − + 2Cl − = Sn 3 O(OH) 2 Cl 2 + H 2 O + 6e − …”
Section: Resultssupporting
confidence: 85%
“…The element aluminum changes the analytical microstructure of a lead-free solder alloy, increasing its solderability and mechanical properties [25]. It has been reported that the microstructure of the solder alloy containing Sn-Al consists of rich Sn and rich Al phases.…”
Section: Introductionmentioning
confidence: 99%