Electrochemical behavior of organic/inorganic films applied on tinplate in different aggressive media

Álvarez, D.; Collazo, A.; Nóvoa, X.R.; Pérez, C.

doi:10.1016/j.porgcoat.2014.02.004

Cited by 17 publications

(11 citation statements)

References 33 publications

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“…After 48 hours of immersion, tinplate exhibited two overlapping time constants. A similar result as has been observed by other authors 6 , which indicates the degradation of the tin oxides and probably the metal corrosion, as a new process governed by diffusion apparently begins as indicated by the low value of n. This explanation is corroborated by the fact that there is, initially, a high and medium resistance, which declines drastically and that red corrosion products were observed on the electrode surface at the end of the experiment, indicating the formation of iron oxides (Figure 8-a). Figure 9 shows a representation of the interface between the sample/electrolyte, equivalent to an electric circuit simulation of the data obtained after 96 hours of EIS.…”

Section: Electrochemical Impedance Spectroscopysupporting

confidence: 93%

“…Along the years, researchers have been working on modifying the thickness of these materials, aiming, among other things, to reduce costs. Steel represents up to 80% of the cost of packaging and any reduction in thickness of the plate is economics 5,6 . Regarding the quality of tinplate, it is worth mentioning the presence of tin oxide on the surface and the passivation layer.…”

Section: Introductionmentioning

confidence: 99%

“…Typically, the tinplate has a full or partial coverage of tin oxides (SnO X ), which may contain stannous oxide (SnO) or stannic oxide, including its hydrated forms. The presence of excessive amounts of these oxides can change the appearance, the weldability of the metal sheet and the ability to receive organic coatings 6,7 . A critical point is observed in the welded region, where the tinplate steel is more exposed due to the partial removal of the tin by the copper wire and its detachment from the surroundings due to the temperature and pressure applied in the welding process.…”

Section: Introductionmentioning

confidence: 99%

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Corrosion Mechanism Suggested Based on Electrochemical Analysis and SVET for Uncoated Tinplate and Post Coated With a Hybrid Film

et al. 2017

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The tinplate, used in the packaging sector and formed from a metal substrate, comprises a steel base which has undergone a surface treatment to produce a thin layer of FeSn 2 , a tin layer and an oxide tin layer. Currently, packaging using surface treatment is based on the use of chromates because these metals provide an excellent corrosion resistance. Nontoxic alternatives to pre-treatments have been developed in recent years to replace the chromate process. The aim of this work is to analyze the performance of a new hybrid organic-inorganic film obtained from sol-gel consisting of the alkoxide precursors 3-(Trimethoxysilylpropyl)methacrylate (TMSM) and tetraethoxysilane (TEOS) with the addition of cerium nitrate with the scanning vibrating electrode technique (SVET), and electrochemical and morphological characterizations. Moreover, the evolution of the corrosion of the substrate was evaluated to propose a mechanism of corrosion. The results showed a galvanic coupling between the Sn/SnO 2 coat (cathode) and the defects exposed at the ferrous base (anode). The organic-inorganic hybrid film containing a cathodic corrosion inhibitor was able to retard the corrosion of the tinplate.

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Section: Electrochemical Impedance Spectroscopysupporting

confidence: 93%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Corrosion Mechanism Suggested Based on Electrochemical Analysis and SVET for Uncoated Tinplate and Post Coated With a Hybrid Film

et al. 2017

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“…Indeed, the anode current density increases with the electrode potential to reach a current plateau called passivation plateau. The formation of the passive layer could be related to the presence of tin oxide/hydroxide that partially passivates the metallic surface, as confirmed by some authors [18][19][20][21]. The passive current density remains almost constant (passive region), and then abruptly increases at a certain critical pitting potential (Epit.…”

Section: Methodsmentioning

confidence: 64%

The Effects of Chloride and Sulphate Ions on the Electrochemical Behaviour of Tin in Aqueous Solutions

Addi¹,

Addi²,

Hamdani³

2018

Port. Electrochim. Acta

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The corrosion behaviour of pure tin in an aqueous solution simultaneously containing Cl -and SO4 2-ions has been studied using electrochemical techniques, optical and scanning electron microscopy. Measurements were conducted under different chloride and sulphate ions concentrations. The potentiodynamic polarisation curves showed that the pitting potential, Epit, is independent from the variation of pH, temperature and chloride and sulphate concentration of the solution. In its turn, an increase of these parameters stimulates shifting of corrosion potential to more active values and leads to an increase of the corrosion and passive current densities. The electrochemical features were strongly supported by optical and scanning electron micrographs of the corroded surfaces of the pure tin samples after potentiodynamic polarisation experiments and immersion tests.

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“…These changes potentially have significant implications for the European steel packaging industry. Alternatives to chrome (VI) passivation systems have been studied including cerium, TiO 2 , sol‐gel derived silanes, polymers, and fluorozirconic acid . While these represent advances in the pursuit of Cr (VI) free passivation, Cr (VI) has remained the dominant industry method.…”

Section: Introductionmentioning

confidence: 99%

Identifying interlayer surface adhesion failure mechanisms in tinplate packaging steels

et al. 2019

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Tinplate surface morphology and chemistry is adjusted during the manufacturing process in order to meet the demands of its subsequent product use, the commonest being visual appearance and food packaging stability. A comprehensive experimental study on an industrial tinning line varied the surface roughness and the tin coating weight with the characterization through X‐ray diffraction (XRD), X‐ray photoelectron spectroscopy (XPS), white light interferometer (WLI), optical imaging, and lacquer adhesion measurement. Increasing tin weight lowers the adhesion through the production of a thicker disorganized tin oxide layer which has a greater tendency to fracture under shearing forces. There is no evidence that the substrate roughness improves the adhesion of the lacquer. Analysis of the failure location identifies fracture in the tin oxide layer below the passivation layer. The findings have impacts on the next generation of passivation materials for tinplate as it has been clearly demonstrated that growth in tin oxide thickness, particularly when unstructured, has a detrimental impact on lacquer adhesion.

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Electrochemical behavior of organic/inorganic films applied on tinplate in different aggressive media

Cited by 17 publications

References 33 publications

Corrosion Mechanism Suggested Based on Electrochemical Analysis and SVET for Uncoated Tinplate and Post Coated With a Hybrid Film

Corrosion Mechanism Suggested Based on Electrochemical Analysis and SVET for Uncoated Tinplate and Post Coated With a Hybrid Film

The Effects of Chloride and Sulphate Ions on the Electrochemical Behaviour of Tin in Aqueous Solutions

Identifying interlayer surface adhesion failure mechanisms in tinplate packaging steels

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