Electrochemical behavior of gold in acidic chloride solutions

Gaur, J.N.; Schmid, G. M.

doi:10.1016/s0022-0728(70)80152-8

Cited by 42 publications

(42 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Figure 1, but without the anodic peak shown at 0.25 V (vs. Ag/AgCl), was shown in the study by Gao et al [32]. This results chiefly in the formation of AuCl 4 À [32,36]. The formations of the Au (3 ) ions on the roughened Au were also reported in the literature [9,11,16].…”

Section: Characteristics Of Roughened Au In the Orc Proceduressupporting

confidence: 62%

See 1 more Smart Citation

Characteristics of Cl‐ and Au‐Containing Nanocomplex and Its Effect on the Following Electrodeposition of Polypyrrole

Liu

Liang

2003

Electroanalysis

View full text Add to dashboard Cite

In this study, polypyrrole (PPy) films were electrochemically deposited on gold substrates roughened by a triangularwave oxidation-reduction cycle (ORC) with different anodic and cathodic vertexes in an aqueous solution containing 0.1 N NaCl. In ORC treatment, the Cl-and Au-containing nanocomplex was formed on the surface of gold. The results indicate that the crystalline orientation and diameter of Au are significantly different before and after ORC treatment. Also the redox behavior in ORC, surface morphology formed and depth profile of Cl in the nanocomplex are influenced by the anodic and cathodic vertexes used in roughening Au. The roughened Au demonstrates an electrocatalytic activity for pyrrole polymerization. Correspondingly, the characteristics of PPy films electrodeposited on these roughened Au substrates are notable. They include the surface-enhanced Raman scattering (SERS) effect shown, a higher conductivity obtained and an increase in oxidation level demonstrated.

show abstract

Section: Characteristics Of Roughened Au In the Orc Proceduressupporting

confidence: 62%

“…These chloride peaks at 208 and 199 eV are assigned to Cl (7 ) and Cl (1 À ), respectively [37]. The presence of Cl (1 À ) ions represents the formation of the AuCl 4 À complex [32,36]. However, the presence of Cl (7 ) ions may represent the existence of the Au(ClO 4 ) 4 À complex [38,39].…”

Section: Characteristics Of Roughened Au In the Orc Proceduresmentioning

confidence: 99%

Characteristics of Cl‐ and Au‐Containing Nanocomplex and Its Effect on the Following Electrodeposition of Polypyrrole

Liu

Liang

2003

Electroanalysis

View full text Add to dashboard Cite

show abstract

“…The oxidized Au can be assigned to monovalent Au (I) and trivalent Au (III) at 85.2 and 86.7 eV, respectively [34]. No further deconvolution was made and trivalent Au (III), as usually shown in the Cl and Au-containing complex [19,35,36], was adopted in this study. Combining the electronic configuration of Cl shown in Fig.…”

Section: Electrocatalytical Polymerization Of Pyrrole On the Roughenementioning

confidence: 99%

Temperature effect of electrochemically roughened gold substrates on polymerization electrocatalysis of polypyrrole

Yang

Liu

2009

Analytica Chimica Acta

View full text Add to dashboard Cite

“…According to another theoretical explanation [17], the following chemical `chain reaction' is also possible in acidic media, which is present in the anode region (since the deposition of…”

Section: Introductionmentioning

confidence: 99%

Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl

Medgyes

2017

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

The electrochemical migration (ECM) mechanism occurs at the presence of moisture in the case of operating circuits and results in shorts (dendrites) between adjacent conductor lines/traces. Dendrite growth occurs as a result of metal ions being dissolved into a solution from the anode and deposited at the cathode, thereby growing in tree-like formations. In this study the water condensation process and ECM behavior of Nickel (Ni), Electroless Nickel Immersion Gold (ENIG) and pure copper were investigated using Thermal Humidity and Bias (THB) test in NaCl environment. The THB results show that Cu has higher ECM resistance than Ni and ENIG surface finishes, which was an unexpected result. The main influencing factors of the water condensation (e.g.: surface roughness, thermal parameters) and the ECM processes (precipitates and dendrites) were investigated and discussed in details. Furthermore, a novel ECM model for Ni and NiAu surface finish was established using THB test in case NaCl contaminated samples.

show abstract

Electrochemical behavior of gold in acidic chloride solutions

Cited by 42 publications

References 17 publications

Characteristics of Cl‐ and Au‐Containing Nanocomplex and Its Effect on the Following Electrodeposition of Polypyrrole

Characteristics of Cl‐ and Au‐Containing Nanocomplex and Its Effect on the Following Electrodeposition of Polypyrrole

Temperature effect of electrochemically roughened gold substrates on polymerization electrocatalysis of polypyrrole

Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl

Contact Info

Product

Resources

About