Electrochemical and structural properties of electroless Ni-P-SiC nanocomposite coatings

Effect of annealing temperature on microstructure, mechanical and tribological properties of nano-SiC reinforced Ni-P coatings

“…However, it is worth noting that these studies investigated only the effects of SiC nanoparticles on the microstructures, corrosion resistance [26][27][28][29][30] and wear resistance of the as-plated coatings [31,32]. Therefore, there is still a large gap in the relationship between microstructure, mechanical and tribological properties of Ni-P/(nano)SiC coatings.…”

“…As reported in Table 1, incorporation of reinforcing particles increases the hardness of Ni-P coatings, especially when SiC particles were used. Moreover, studies [18,19] have demonstrated that the incorporation of SiC particles in a Ni-P matrix is the most effective combination of cost and performance in industrial applications.Regarding Ni-P/SiC composite coatings, SiC particles with a size ranging between 0.5-6.0 µm was mostly used [20][21][22][23][24][25], while only a few studies investigated the use of nano-sized SiC particles (40-50 nm) [26][27][28][29][30][31][32]. However, it is worth noting that these studies investigated only the effects of SiC nanoparticles on the microstructures, corrosion resistance [26][27][28][29][30] and wear resistance of the as-plated coatings [31,32].…”

Electroless Nanocomposite Coatings: Synthesis, Characteristics, and Applications

“…Subsequently, the nanoparticle suspension is added to the EL plating bath. This procedure is widely used for many types of nanoparticles, viz., SiC [13,14], WC [15], TiO 2 [16], Al 2 O 3 [17], halloysite nanotubes [18], ZrO 2 [19], WS 2 [20] TiN [21], TiC [22] Si 3 N 4 [23] diamond [24], etc. Besides CNTs, ball milling is also considered as a pretreatment for other nanoparticles.…”

“…Various types of surfactants, namely, anionic, cationic, and nonionic, are used for this purpose. The most commonly used surfactants are cetyltrimethylammonium bromide (CTAB), dodecyltrimethylammonium bromide (DTAB), hexadecyltrimethylammonium bromide (HTAB), sodium dodecyl sulfate (SDS), 1,3-toloyltriethanolammonium chloride (TTAC), tetraethyleneglycol dodecyl ether (Brij 30), polyethylene glycol (PEG), and fluorosurfactants [6,11,14,16,17,[27][28][29][30]. It is important to understand the role of surfactants and its interaction with the nanoparticles so that an effective dispersion of nanoparticles could be achieved in the plating bath.…”

Development of diffusion barrier layer on copper-printed circuit board using electroless plating method

“…In other works mentioned by previous researchers in [8][9][10], the crystallized Ni 3 P phase has a polycrystalline columnar structure that appears to contain defects. During reflow soldering, Kirkendall voids would form as a by-product of P-rich layer formation and these voids are claimed to be detrimental on joint reliability by resulting in brittle fracture.…”