1971
DOI: 10.1149/1.2407828
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Electrochemical and Structural Aspects of Gold Electrodeposition from Dilute Solutions by Direct Current

Abstract: The electrochemical and structural aspects of gold deposition from dilute cyanide, citrate, and phosphate‐buffered plating solutions were studied using rotating disk electrodes. Current‐potential curves were recorded galvano‐statically for 0.005M Au solutions at 60°C, and the morphology of deposits approximately 1µ thick, which corresponded to different regions of the i–V curves, was determined by scanning electron microscopy. Transmission electron microscopy was used to elucidate the early stages of growth (∼… Show more

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Cited by 36 publications
(27 citation statements)
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References 12 publications
(19 reference statements)
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“…Based on the (Fig. 4a), charge transfer coefficient is found to be 0.67 ± 0.01 which is in agreement with the value obtained by Chen and Sard [28]. Kinetic constant is a function of temperature and activation energy [26].…”
Section: Solutionsupporting
confidence: 86%
See 1 more Smart Citation
“…Based on the (Fig. 4a), charge transfer coefficient is found to be 0.67 ± 0.01 which is in agreement with the value obtained by Chen and Sard [28]. Kinetic constant is a function of temperature and activation energy [26].…”
Section: Solutionsupporting
confidence: 86%
“…The value of kinetic constant is calculated to be (3.3 ± 0.1) Â 10 À4 (cm/s) based on (Fig. 4b) which is lower than that reported by Chen and Sard [28]. However, their experiments were done at higher temperature.…”
Section: Solutioncontrasting
confidence: 54%
“…Extensive operative knowledge of the behaviour of these systems has accumulated during the decades and these baths are universally recognised as state-of-the-art reliable technologies. Electrochemical investigations on this topic have mainly concerned the definition of the mechanism of metal deposition from their cyanocomplexes [3][4][5][6][7]. Recently, the research has been mainly directed towards the definition of alternative cyanide-free baths [8] and several patents have been filed, chiefly regarding the use of sulphite, thiourea, thiosulphate or other sulphorated compounds as metal ligands; a comprehensive list of the patent literature would be well beyond the scope of this paper.…”
Section: Introductionmentioning
confidence: 99%
“…Electroplating of gold can be performed from a variety of aqueous solutions containing a variety of additives that are known to have various influences on the deposited metal layer (see, for example, Cheh and Sard, 1971;Bindra et al, 1989), as well as the electro-chemical properties of the solution. In general, the aqueous solution contains excess inert electrolyte such as potassium and citrate ions, which do not take part in the reaction at either electrode, but do migrate within the electric field and thereby act to carry the majority of current within the bulk of the solution.…”
Section: Aiche Journalmentioning
confidence: 99%
“…In general, the aqueous solution contains excess inert electrolyte such as potassium and citrate ions, which do not take part in the reaction at either electrode, but do migrate within the electric field and thereby act to carry the majority of current within the bulk of the solution. Gold is generally present in the solution (Cheh and Sard, 1971) as the negatively charged ion gold dicyanide Au(CN),-and normally may be regarded as a minor ionic component since typical concentrations are 0.1 M. As a gold dicyanide ion approaches the cathode surface, the intense field in the electrochemical double layer acts to promote the forward reaction for The liberated gold ions are then deposited on the cathode according to the reaction while the cyanide ions combine with hydrogen in solution to form hydrogen cyanide gas. Some evolution of hydrogen gas may also occur at the cathode, but this typically only accounts for 1% or less of the total current.…”
Section: Aiche Journalmentioning
confidence: 99%