1989
DOI: 10.1002/bbpc.19890930107
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Electrochemical and solid state reactions of copper with n‐SnS2

Abstract: The intercalation reaction of Cu with n‐SnS2 has been studied with a variety of techniques. Electrochemical and photoelectrochemical methods provided information about the energetics of the intercalation reaction and the band gap and carrier type of the new phase (p‐CuSnS2). X‐ray photoelectron spectroscopy (XPS) was used to characterize the stoichiometry of the new phase as prepared both electrochemically and in UHV. The thermal stability of CuSnS2 was studied with XPS and transmission electron microscopy (TE… Show more

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Cited by 19 publications
(2 citation statements)
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“…Cu + diffused up through the SnS 2 layer to the surface of the film. Such facile Cu + diffusion in SnS 2 has been observed before and is consistent with the disappearance of the Cu 2 S peaks in the XRD spectrum for the 167Cu 2 S/800SnS 2 bilayer (Figure ). For the surface of the film, the Cu atomic concentration based on Sn was estimated to be 10% by the standard CasaXPS procedure using core level Cu 2p and Sn 3d lines.…”
Section: Resultssupporting
confidence: 89%
“…Cu + diffused up through the SnS 2 layer to the surface of the film. Such facile Cu + diffusion in SnS 2 has been observed before and is consistent with the disappearance of the Cu 2 S peaks in the XRD spectrum for the 167Cu 2 S/800SnS 2 bilayer (Figure ). For the surface of the film, the Cu atomic concentration based on Sn was estimated to be 10% by the standard CasaXPS procedure using core level Cu 2p and Sn 3d lines.…”
Section: Resultssupporting
confidence: 89%
“…3,4 Monovalent atoms adsorbed on the van der Waals planes of single crystals are intercalated and the intercalation phases can be characterized in situ with the use of surface science techniques in UHV. [5][6][7] In spite of the intensive studies the intercalation pathway and transport mechanism of the atoms after adsorption had not been determined so far. In principle, the mechanism of intercalation may occur either by the direct transport via tetrahedral holes through the van der Waals layers, 6 or by crossing the van der Waals planes via defects or dislocations.…”
Section: Introductionmentioning
confidence: 99%