Electrochemical activation of substrate surfaces in microelectroforming

Abstract

Microelectroforming is a modern manufacturing process for producing metal microstructures in the field of microelectronic mechanical systems. Electrochemical activation of the substrate surfaces can enhance the adhesion strength between the electroforming layer and the substrate at the first stage of microelectroforming. The mechanism of current density affecting the activation of the substrate surfaces was explored. The cathodic overpotential was carried out with the chronopotentiometric method under different current density conditions. The current density at the first stage of microelectroforming was the largest contributor to the electrochemical activation of the substrate surfaces. As the current density was set in the range of 0.2-1.2 A/dm 2 , effective electrochemical activation occurred on the substrate surfaces. Although the current density was 0.4 A/dm 2 , the effect of substrate activation is optimal and the adhesion strength between the electroforming layer and the substrate reached its maximum.