2021 IEEE 4th International Conference on Electronics and Communication Engineering (ICECE) 2021
DOI: 10.1109/icece54449.2021.9674655
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Electro-Thermal Model for Schottky Barrier Diode Based on Self-Heating Effect

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Cited by 6 publications
(2 citation statements)
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“…The advantage of this structure is that it reduces the number of computational grids to speed up the simulation. The individual diode thermal analysis is convenient in [25,26]. However, the heat flow of the packaging diode is crucial to analyzing the overall temperature distributions and optimizing the thermal flow from the anodes to the waveguide block.…”
Section: D-em and Steady-state Thermal Modelmentioning
confidence: 99%
“…The advantage of this structure is that it reduces the number of computational grids to speed up the simulation. The individual diode thermal analysis is convenient in [25,26]. However, the heat flow of the packaging diode is crucial to analyzing the overall temperature distributions and optimizing the thermal flow from the anodes to the waveguide block.…”
Section: D-em and Steady-state Thermal Modelmentioning
confidence: 99%
“…The individual diode thermal analysis is convenient in [28,29]. However, the heat flow of the packaging diode is crucial to analyzing the overall temperature distributions and optimizing the thermal flow from the anodes to the waveguide block.…”
Section: E-t Model With Thermal Effectsmentioning
confidence: 99%