Electro-osmotic flow in microchannels

Arnold, Anton; Nithiarasu, Perumal; Eng, P. F.

doi:10.1243/09544062jmes784

Cited by 8 publications

(11 citation statements)

References 20 publications

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“…It is relatively easy to verify the experimental flow results on simple channels against numerical modelling (Eng and Nithiarasu 2009;Arnold et al 2008a;Singh et al 2008). The micro-channel used for this purpose has a width, depth and length of 30, 10 and 0.1 mm, respectively.…”

Section: Flow Measurement Resultsmentioning

confidence: 99%

“…The micro-channel used for this purpose has a width, depth and length of 30, 10 and 0.1 mm, respectively. For the numerical procedure employed and many other numerical tests, the readers are referred to (Eng and Nithiarasu 2009;Arnold et al 2008a;Singh et al 2008;Arnold et al 2008b). For the numerical simulation, a zeta potential of 19.26 mV is used as the wall boundary condition for the static electric field equation.…”

Section: Flow Measurement Resultsmentioning

confidence: 99%

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An experimental study on an electro-osmotic flow-based silicon heat spreader

Eng

Nithiarasu

Guy

2010

Microfluid Nanofluid

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An experimental study has been carried out to estimate the heat transfer improvement offered by a novel electro-osmotic (EO) heat spreader for microprocessor cooling. The proposed design of the elliptical silicon heat spreader can be fabricated at the back surface of the microprocessor as an integral part. Thus, no extra space may be required. The EO heat spreader developed is 0.6 mm 3 in volume and it contains a pair of thin gold film electrodes of approximately 1 lm thickness for applying an external electric field that induces electro-osmotic flow. The inner channel surfaces of the heat spreader are electrically insulated with a thin SiO 2 layer to minimize current leakage into the wafer. The EO heat spreader constructed is able to generate a flow rate of 0.2028 ll/min at 2 V/mm. With this heat spreader, the temperature of a heat source may be reduced by up to 4°C without the aid of any external mechanical devices. The heat spreader has the potential to make the temperature uniform, if the heat source is non-uniform in nature.

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Section: Flow Measurement Resultsmentioning

confidence: 99%

Section: Flow Measurement Resultsmentioning

confidence: 99%

An experimental study on an electro-osmotic flow-based silicon heat spreader

Eng

Nithiarasu

Guy

2010

Microfluid Nanofluid

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“…All the results given in the present work are generated by assuming h ¼ h 1 ¼ h 2 ¼ 0 [36,37,[40][41][42][43][44][45]. The semidiscrete forms of the electric field, flow (Steps 1 to 3), and energy [Eq.…”

Section: Governing Equations and Solution Proceduresmentioning

confidence: 99%

“…Since the velocities expected are very small and the element Peclet number is well below unity, convective stabilization is not necessary [46]. For further details on the discretization and solution methodology, refer to [36,37,39]. Figure 1 shows a schematic of the model used in the present study.…”

Section: Governing Equations and Solution Proceduresmentioning

confidence: 99%

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Numerical Investigation of an Electroosmotic Flow (EOF)–Based Microcooling System

Eng

Nithiarasu

2009

Numerical Heat Transfer, Part B: Fundamentals

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An electroosmotic flow (EOF)-based heat spreader is studied using the finite-element method and an artificial compressibility-based time-stepping scheme. The heat spreader consists of a microprocessor, microchannels, and a standard plate-fin heat sink. All three components are assumed to be tightly integrated. The microchannels are used to induce EOF, and a conjugate heat transfer analysis is carried out in the presence of the EOF. The heat transfer results from the microprocessor surface to the EOF channel and from the EOF channel to the plate-fin heat sink show clearly that the EOF enhances heat transfer and thus it has the potential to be used as an effective heat spreader mechanism. For the materials and parameters used, the temperature at a section above the microchannel has been reduced by up to 6 C. This is equivalent to reducing the heat-sink fin height by a length equal to about the depth of the microchannel employed.

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Electromagnetohydrodynamic flow transport of two layer fluids through a microchannel with interfacial slip at fluid-solid interface

Rana

Mishra

Reza

et al. 2021

J. Phys.: Conf. Ser.

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This work investigates an electromagnetohydrodynamic flow of two layer fluids through a microchannel under the influence of interfacial slip at fluid-solid interface. The governing equations of conservation of momentum and potential distribution equations with Debye-Huckel approximation has been simplified analytically. The effects of different parameters like transverse electric field, viscosity ratio, interfacial charge density has been presented graphically. Also this study explored that the effect of Hartmann number and large Hartmann number on the velocity of fluid are almost opposite. These results are valid to the available data. Also it is shown that the interfacial charge density has a crucial role to play with the velocity of a fluid.

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Electro-osmotic flow in microchannels

Cited by 8 publications

References 20 publications

An experimental study on an electro-osmotic flow-based silicon heat spreader

An experimental study on an electro-osmotic flow-based silicon heat spreader

Numerical Investigation of an Electroosmotic Flow (EOF)–Based Microcooling System

Electromagnetohydrodynamic flow transport of two layer fluids through a microchannel with interfacial slip at fluid-solid interface

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