Electro-mechanical evaluation of Ag trace patterns by ink-jet printing

Lee

Int J Adv Manuf Technol

et al. 2015

A hybrid process including roll-to-roll (R2R) gravure printing, via-hole printing, and electroless plating was investigated for the creation of a double-side flexible printed circuit board (FPCB). A R2R gravure process with an Ag seed layer that includes front-and back-side printing with a polyimide film at the center was investigated. The gravure-printed Ag pattern was laser drilled for high accuracy. A via hole was filled with a low-viscosity Ag ink using the drop-casting method. In addition, an electroless Cu plating process was performed to increase the conductivity of the printed circuit. The interconnection performance was confirmed from the resistance values obtained using a feed-through test and microscopic images. To evaluate the reliability of the FPCB, a cyclic bending motion test was performed; stable electrical performance was observed even after 400,000 cycles. The results obtained in this study suggest that the proposed hybrid process for double-side FPCBs is viable for a mass production system.

Section: Methodsmentioning

confidence: 99%

Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating

Lee

Int J Adv Manuf Technol

et al. 2015

2012 IEEE 62nd Electronic Components and Technology Conference

“…A few studies have discussed the topic [9], [10] but in-depth study and reliability analysis are definitely required.…”

Section: Introductionmentioning

confidence: 99%

Dynamic bending test analysis of inkjet-printed conductors on flexible substrates

Halonen

Halme

Karinsalo

et al. 2012

The need to optimize space in electronic devices has made flexible electronics an attractive option for manufacturing electronics. Techniques to fabricate flexible circuits have become more and more common and the processes increasingly more efficient. Printed electronics is a potential technique for manufacturing electronic patterns on flexible substrates. In particular, inkjet printing is an effective way to produce fine, thin, conductive structures without touching the substrate material. This study concentrated on dynamic bending analysis of inkjet-printed silver conductors on a polymer substrate. Because printed electronics is a relatively new manufacturing method, not much research is yet available on mechanical endurance of printed structures. By default, thin layers of inkjet-printed traces may just prove to have good tolerance against bending. However, factors such as adhesion between ink layer and substrate and the effect of the porous structure of sintered nanoparticle ink must be studied. This paper evaluates the capability of the inkjet technique on a flexible substrate and benchmarks the results on conventional flexible copper circuit boards. Measurements were made in real time of the resistance of conductors while bending the sample along two different radii. Results showed that printed conductors were superior in endurance over etched copper circuits.

Proceedings of the 36th International Spring Seminar on Electronics Technology

“…This method allows to develop a sensor that can be used to measure deformation, and also to measure the life cycle of a material [1].…”

Section: Introductionmentioning

confidence: 99%

Ink-jet printed strain sensor on polyimide substrate

Zlebic

Kisić

Blaz

et al. 2013

This paper describes a method for measuring strain on a specimen with flexible strain sensor. The sensor is made by ink-jet printing of silver ink on polyimide substrate, in that manner providing a combination of electrical conductivity and mechanical flexibility. When a force is applied on the free end of cantilever beam, three different strain gauges are used to measure flex of the beam. The gauge is taped at the fixed end of the beam, on the top side. To determine the strain, it requires accurate measurement of small resistance change, therefore strain gauge is connected to the Source Meter Keithley 2410. This work will consolidate the research on theoretical, technological and experimental aspect of design, development and validation of resistive sensors that are flexible, bendable and stretchable.