2010
DOI: 10.1007/s12540-010-0619-1
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Electro magnetic interference shielding characteristic of silver coated copper powder

Abstract: The present investigation deals with the synthesis of silver coated copper powder for potential application as filler material in conductive polymers for electro magnetic interference (EMI) shielding. Copper powders were obtained by the reaction of cuprous oxide and, hydrazine in a mixed solvent (H2O:ethanol) at various reaction conditions. The cuprous oxide powder was produced by the reaction of CuSO4, NaOH and D-glucose. The synthesized copper powder was silver coated by its reaction with (NH4)2SO4, C4H4O6KN… Show more

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Cited by 13 publications
(4 citation statements)
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“…In order to reduce these undesired effects, the development of materials with a high capacity for EMI shielding has attracted a great deal of attention in the academic and industrial scientific communities over the last two decades . Generally, metallic materials, metal‐coated polymers, or composites of metal powder and polymers have been used as materials for EMI shielding due to their high conductivity. However, these materials possess several drawbacks such as poor chemical resistance, a propensity to oxidize and/or corrode, and a high density.…”
Section: Introductionmentioning
confidence: 99%
“…In order to reduce these undesired effects, the development of materials with a high capacity for EMI shielding has attracted a great deal of attention in the academic and industrial scientific communities over the last two decades . Generally, metallic materials, metal‐coated polymers, or composites of metal powder and polymers have been used as materials for EMI shielding due to their high conductivity. However, these materials possess several drawbacks such as poor chemical resistance, a propensity to oxidize and/or corrode, and a high density.…”
Section: Introductionmentioning
confidence: 99%
“…There is a direct reduction reaction of Ag + ions, which is called a "replacement-reduction" method. The chemical equations for silver ammonia solution and silver deposition are as follows [16,17]:…”
Section: Characterization Of Specimensmentioning
confidence: 99%
“…33,34 Selecting and matching the complexing agent are important in electroless plating because the agent determines the stability of the plating solution, the plating rate, and the properties of the Ag coating. 35,36 Although ammonium hydroxide is commonly used as a complexing agent for electroless Ag plating onto Cu powders (Table S1 †), 31,32,34,[37][38][39][40][41] the stability of the cuprammonium complex and Ag-ammine complex is unsatisfactory. 42,43 It is difficult to control the plating rate and stability of the plating bath, which is a major challenge for large-scale production.…”
Section: Introductionmentioning
confidence: 99%