Electrically Robust Metal Nanowire Network Formation by In-Situ Interconnection with Single-Walled Carbon Nanotubes

Abstract

Modulation of the junction resistance between metallic nanowires is a crucial factor for high performance of the network-structured conducting film. Here, we show that under current flow, silver nanowire (AgNW) network films can be stabilised by minimizing the Joule heating at the NW-NW junction assisted by in-situ interconnection with a small amount (less than 3 wt%) of single-walled carbon nanotubes (SWCNTs). This was achieved by direct deposition of AgNW suspension containing SWCNTs functionalised with quadruple hydrogen bonding moieties excluding dispersant molecules. The electrical stabilisation mechanism of AgNW networks involves the modulation of the electrical transportation pathway by the SWCNTs through the SWCNT-AgNW junctions, which results in a relatively lower junction resistance than the NW-NW junction in the network film. In addition, we propose that good contact and Fermi level matching between AgNWs and modified SWCNTs lead to the modulation of the current pathway. The SWCNT-induced stabilisation of the AgNW networks was also demonstrated by irradiating the film with microwaves. The development of the high-throughput fabrication technology provides a robust and scalable strategy for realizing high-performance flexible transparent conductor films.

Totally embedded hybrid thin films of carbon nanotubes and silver nanowires as flat homogenous flexible transparent conductors

“…reported hybrid films of graphene nanosheet–silver nanowires by dipcoating process with sheet resistance of 71 Ω/sq and 85% light transmittance. Woo et al 43. prepared a hybrid film by direct mixing of SWCNTs functionalized with quadruple hydrogen bonding (QHB) motifs and aqueous suspension of AgNWs and spray coated onto PET substrate.…”

Highly flexible transparent thin film heaters based on silver nanowires and aluminum zinc oxides

“…Furthermore, under high current flow, the relatively high junction resistance between the AgNWs negatively affects the network stability, which breaks up the NWs at the junction [11,18]. Hence, increasing the density of the AgNWs (surface coverage) cannot be a solution for improving the non-uniform heating [5].…”

“…Various approaches have been developed to increase the network uniformity. Compositing with other materials, such as CNTs and nano-platelets, to improve the interconnection of AgNWs was previously investigated [5,11]. However, the original density of the AgNWs must be high for the incorporation materials to effectively enhance the uniform interconnection.…”

“…However, as in other applications of TCEs, the next generation of TFHs requires that the TCEs are highly flexible and can reversibly accommodate large amounts of compressive and tensile strains [10]. Furthermore, the manufacturing process should be cost-effective at large scales [11]. However, TCOs are inherently brittle and ITO is prohibitively expensive for use in substrates with large areas due to the scarcity of indium [3].…”

“…The spatial variation in the network density leads to non-uniform heating in f-TFHs, forming hot-zones that disconnect the network [11]. Furthermore, under high current flow, the relatively high junction resistance between the AgNWs negatively affects the network stability, which breaks up the NWs at the junction [11,18].…”