Electrically interconnected assemblies of microscale device components by printing and molding

Kim, Mo Joon; Yoon, Jongseung; Park, Sang-Il; Rogers, John A.

doi:10.1063/1.3268464

Cited by 8 publications

(7 citation statements)

References 22 publications

(34 reference statements)

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“…Also, the bottom surfaces of the devices are passivated with thermal oxide, thereby minimizing any infl uence of the substrate on their performance. When implemented using foundry wafer fabrication facilities for the devices and advanced inkjet, [ 20 ] electrohydrodynamic, [ 21 , 22 ] direct-write, [ 23 ] or alternative printing techniques [ 24 ] for the interconnect, these procedures have the potential to bypass the need for any additional specialized processing technology for large-area electronics, or other nonwafer applications such as those that demand fl exible, stretchable, or curvilinear substrates.…”

Section: Discussionmentioning

confidence: 99%

Fabrication of Releasable Single‐Crystal Silicon–Metal Oxide Field‐Effect Devices and Their Deterministic Assembly on Foreign Substrates

Chung

Kim

et al. 2011

Adv Funct Materials

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A new class of thin, releasable single‐crystal silicon semiconductor device is presented that enables integration of high‐performance electronics on nearly any type of substrate. Fully formed metal oxide–semiconductor field–effect transistors with thermally grown gate oxides and integrated circuits constructed with them demonstrate the ideas in devices mounted on substrates ranging from flexible sheets of plastic, to plates of glass and pieces of aluminum foil. Systematic study of the electrical properties indicates field‐effect mobilities of ≈710 cm2 V−1 s−1, subthreshold slopes of less than 0.2 V decade−1 and minimal hysteresis, all with little to no dependence on the properties of the substrate due to bottom silicon surfaces that are passivated with thermal oxide. The schemes reported here require only interconnect metallization to be performed on the final device substrate, which thereby minimizes the need for any specialized processing technology, with important consequences in large‐area electronics for display systems, flexible/stretchable electronics, or other non‐wafer‐based devices.

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Section: Discussionmentioning

confidence: 99%

Fabrication of Releasable Single‐Crystal Silicon–Metal Oxide Field‐Effect Devices and Their Deterministic Assembly on Foreign Substrates

Chung

Kim

et al. 2011

Adv Funct Materials

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“…Replica molding techniques enable such conductive elastomers to be patterned into geometries with feature sizes from the micron to centimeter range. Here, composite pastes of Ag and uncured PDMS fill into trenches defined by patterns of photoresist, similar to processes described previously . Measurements of electrical resistance of a patterned conductive trace (30 mm × 150 μm × 50 μm) embedded in an insulating elastomer under uniaxial stretching appear in Figure f.…”

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confidence: 95%

All‐Elastomeric, Strain‐Responsive Thermochromic Color Indicators

Zhang

Cheng

et al. 2013

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Recent advances in materials for stretchable electronics create new areas of application, particularly in systems that involve intimate integration with the human body. Examples include wearable electronics, [1][2][3][4][5][6] soft surgical instruments, [ 5,[7][8][9][10][11][12][13] and skin-integrated health/wellness monitors. [ 1,[14][15][16][17][18] Many envisioned systems require schemes for visual information display. Such functionality can be provided by organic or inorganic light emitting diodes (LEDs), either as arrays of non-stretchable devices joined by deformable interconnects, [ 7,19,20 ] or as elements in buckled geometries. [ 19,21 ] Intrinsically stretchable LEDs have also recently been achieved, using all polymer designs. [ 22 ] Here we present a simple, non-emissive option in display materials that likewise offer intrinsic stretchability. The approach uses elastomeric composites of thermochromic materials and metallic particles as the photonic and electronic components, respectively, in concepts that build on related materials [ 23 ] for fl exible displays. We show, additionally, that the types of stretchable displays introduced here can be used as colorimetric indicators of mechanical strain.The thermochromic elastomer uses a well-mixed dispersion of leuco dye (black 47C, LCR Hallcrest) contained in microcapsules and embedded in a silicone elastomer matrix (Smooth-on Inc.), in a construction that is similar to previous reports. [ 23 ] (See the Experimental Section). The dye uses a fl uoran chemistry, with the reversible ability to open (colored) and close (colorless) lactone rings in the presence of acids. [ 24,25 ] The microencapsules contain mixtures of leuco dye with a color developer and a low melting point solvent. At low temperature, the developer and leuco dye form a complex that favors the colored ring-open state. Upon heating, the solvent melts, and the developer and dye dissociate. The leuco dye then favors the colorless, ring-closed state. Such transformations occur in a reversible manner. [23][24][25][26] For the case explored here, at temperatures below ≈47 °C the dye is black; at higher temperatures, the mismatch between the index of refraction of the microencapsulated dye and the surrounding silicone matrix leads to strong optical scattering and a white appearance. The net effect, then, is a temperature activated, reversible switching between black and white. Figure 1 a,b presents confocal and scanning electron microscope images of this type of composite. At room temperature, the composite is black. As the temperature rises above 47 °C, the color changes to bright white, as illustrated by refl ectance measurements across the visible range (Figure 1 c). Mechanical stretching (e.g., deformation to strains of 30%, 60%, etc.) leads to minimal change in the color, as is also indicated in Figure 1 c.Patterns of stretchable conductors integrated directly with this type of thermochromic elastomer provide spatially controlled Joule heating for localized/selectable color switching. Here, we...

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“…Fabrication of Scale Architectures with Edge Anchors : A photolithographically defined pattern of SU‐8 5 (15 μm thick, MicroChem Corp.) on a Si (100) wafer (Addison Engineering) provided rectangular openings (100 μm × 200 μm). Prepolymer to PDMS was poured and scraped over the functionalized (trichlorosilane, United Chemical Technology) surface of this wafer,25 to define the dimensions of edge anchors made of PDMS. Silicon scales were printed on the partially cured surface of the PDMS (60 °C for 30 min).…”

Section: Methodsmentioning

confidence: 99%

Imbricate Scales as a Design Construct for Microsystem Technologies

Kim

Mihi

et al. 2011

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Spatially overlapping plates in tiled configurations represent designs that are observed widely in nature (e.g., fish and snake scales) and man-made systems (e.g., shingled roofs) alike. This imbricate architecture offers fault-tolerant, multifunctional capabilities, in layouts that can provide mechanical flexibility even with full, 100% areal coverages of rigid plates. Here, the realization of such designs in microsystems technologies is presented, using a manufacturing approach that exploits strategies for deterministic materials assembly based on advanced forms of transfer printing. The architectures include heterogeneous combinations of silicon, photonic, and plasmonic scales, in imbricate layouts, anchored at their centers or edges to underlying substrates, ranging from elastomer sheets to silicon wafers. Analytical and computational mechanics modeling reveal distributions of stress and strain induced by deformation, and provide some useful design rules and scaling laws.

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Electrically interconnected assemblies of microscale device components by printing and molding

Cited by 8 publications

References 22 publications

Fabrication of Releasable Single‐Crystal Silicon–Metal Oxide Field‐Effect Devices and Their Deterministic Assembly on Foreign Substrates

Fabrication of Releasable Single‐Crystal Silicon–Metal Oxide Field‐Effect Devices and Their Deterministic Assembly on Foreign Substrates

All‐Elastomeric, Strain‐Responsive Thermochromic Color Indicators

Imbricate Scales as a Design Construct for Microsystem Technologies

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