Electrically insulating polymeric nanocomposites with enhanced thermal conductivity by visible-light curing of epoxy-boron nitride nanotube formulations

Sangermano, Marco; Razza, Nicolò; Graham, Gabriele; Barandiaran, Irati; Kortaberría, Galder

doi:10.1002/pi.5479

Cited by 9 publications

(10 citation statements)

References 25 publications

(24 reference statements)

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“…However, some studies present the possibility to exploit UV-curing to form conductive thermosets. Acrylate based polymers and epoxy resins represent suitable types of matrix to develop UV-curable composites characterized by enhanced thermal conductivity [ 26 , 27 , 28 , 29 ].…”

Section: Introductionmentioning

confidence: 99%

3D Printing of PDMS-Like Polymer Nanocomposites with Enhanced Thermal Conductivity: Boron Nitride Based Photocuring System

et al. 2021

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This study demonstrates the possibility of forming 3D structures with enhanced thermal conductivity (k) by vat printing a silicone–acrylate based nanocomposite. Polydimethylsiloxane (PDSM) represent a common silicone-based polymer used in several applications from electronics to microfluidics. Unfortunately, the k value of the polymer is low, so a composite is required to be formed in order to increase its thermal conductivity. Several types of fillers are available to reach this result. In this study, boron nitride (BN) nanoparticles were used to increase the thermal conductivity of a PDMS-like photocurable matrix. A digital light processing (DLP) system was employed to form complex structures. The viscosity of the formulation was firstly investigated; photorheology and attenuate total reflection Fourier-transform infrared spectroscopy (ATR-FTIR) analyses were done to check the reactivity of the system that resulted as suitable for DLP printing. Mechanical and thermal analyses were performed on printed samples through dynamic mechanical thermal analysis (DMTA) and tensile tests, revealing a positive effect of the BN nanoparticles. Morphological characterization was performed by scanning electron microscopy (SEM). Finally, thermal analysis demonstrated that the thermal conductivity of the material was improved, maintaining the possibility of producing 3D printable formulations.

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Section: Introductionmentioning

confidence: 99%

3D Printing of PDMS-Like Polymer Nanocomposites with Enhanced Thermal Conductivity: Boron Nitride Based Photocuring System

et al. 2021

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“…High thermal conductive composites need to be designed to dissipate and transfer the generated heat, especially for thermal interface materials (TIM) [1,2]. PDMS are widely used in TIM applications [1,[3][4][5][6][7] due to their high flexibility and thermal stability. However, they possess low thermal conductivity (k) which may limit their application in devices.…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Thermal Conductivity of Silicon-Base Composites: The Effect of Filler Materials and Characteristic on Thermo-Mechanical Response of Silicon Composite

et al. 2021

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Thermal conductivity is a key property in many applications from electronic to informatics. The interaction of fillers with Sylgard 184 was studied; this study explores new composites and the influence of metal particles (copper and nickel), carbon-based materials (carbon nanotubes and carbon black), and ceramic nanoparticles (boron nitride) as fillers to enhance thermal properties of silicon-based composites. The effect of the fillers on the final performances of the composite materials was evaluated. The influence of filler volume, dimension, morphology, and chemical nature is studied. Specifically, FT-IR analysis was used to evaluate curing of the polymer matrix. DSC was used to confirm the data and to further characterize the composites. Thermo-mechanical properties were studied by DMTA. The filler morphology was analyzed by SEM. Finally, thermal conductivity was studied and compared, enlightening the correlation with the features of the fillers. The results demonstrate a remarkable dependence among the type, size, and shape of the filler, and thermal properties of the composite materials. Underlining a that the volume filler influenced the thermal conductivity obtaining the best results with the highest added volume filler and higher positive impact on the k of the composites is reached with large particles and with irregular shapes. In contrast, the increase of filler amount affects the rigidity of the silicon-matrix, increasing the rigidity of the silicon-based composites.

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“…Thermally conductive and electrically insulating materials are of a great importance from the scientific point of view, as well as for many applications in industry, and engineering. High thermal conductivity and electrical insulation are rarely found in one material, especially in polymers [1][2][3]. The intrinsic thermal conductivity of polymers is very low (typically 0.1-0.5 W/(m•K)), therefore it is necessary to enhance these properties for material used in special applications, e.g.…”

Section: Introductionmentioning

confidence: 99%

“…These advantages of photopolymerization make it an attractive method for the design and development of new materials with improved thermal properties. Until now photoinitiation has been applied only for the cationic curing of an epoxy resin filled with BN nanotubes [3] (an increase in thermal conductivity at 1.5% of loading reached about 45%) and very recently, in preparation of composites from thermosetting acrylic monomers (not defined) filled with surface modified BN [48]. In this work we present the results of investigations of the methacrylate-based composites with enhanced thermal conductivity, prepared by the in situ photopolymerization method.…”

Section: Introductionmentioning

confidence: 99%

Photocurable acrylate-based composites with enhanced thermal conductivity containing boron and silicon nitrides

Sądej

Gojżewski

Gajewski

et al. 2018

Express Polym. Lett.

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Boron nitride (BN) and silicon nitride (Si 3 N 4) are very promising particulate fillers for production of photocurable composites dedicated to thermally conductive and electrically insulating protective coatings. Composites containing crosslinked methacrylate-based matrices filled with BN or Si 3 N 4 (in amounts up to 5 wt%) were prepared in a fast in situ photocuring process with high conversion (>90%). The monomers were polyethylene glycol dimethacrylate and monomethacrylate (50/50 by weight mixture). Investigations included determination of properties of the monomer/filler compositions, photocuring kinetics and thermal, conductive and mechanical properties of the resulting composites. It was found that addition of the fillers improves polymerization kinetics and mechanical properties compared to the pure polymer matrix. Despite the very low loading level a substantial improvement in thermal conductivity was obtained: a 4-fold increase after addition of only 2 wt% of Si 3 N 4 and 2.5-fold increase after addition of 0.5 wt% of BN. SEM and AFM imaging (with nanoscopic Young's modulus determination) revealed good matrix-filler adhesion for the both types of fillers, tendency of the particles to be preferentially located in the bulk rather than at the interface and formation of thermally conducting paths (for the Si 3 N 4 filler).

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Electrically insulating polymeric nanocomposites with enhanced thermal conductivity by visible-light curing of epoxy-boron nitride nanotube formulations

Cited by 9 publications

References 25 publications

3D Printing of PDMS-Like Polymer Nanocomposites with Enhanced Thermal Conductivity: Boron Nitride Based Photocuring System

3D Printing of PDMS-Like Polymer Nanocomposites with Enhanced Thermal Conductivity: Boron Nitride Based Photocuring System

Investigation of the Thermal Conductivity of Silicon-Base Composites: The Effect of Filler Materials and Characteristic on Thermo-Mechanical Response of Silicon Composite

Photocurable acrylate-based composites with enhanced thermal conductivity containing boron and silicon nitrides

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