Electrically conductive copper film prepared at low temperature by thermal decomposition of copper amine complexes with various amines

Yabuki, Akihiro; Tanaka, Shuji

doi:10.1016/j.materresbull.2012.08.052

Cited by 75 publications

(84 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Inks with 5, 7.5, and 10% DA had resistivity of 50.70, 41.81, and 62.53 μΩ‐cm, respectively. Other researchers used blended amines as complexing agent to improve the conductivity . From here on, research work with blended amines was conducted with inks containing at least 7.5% DA.…”

Section: Resultsmentioning

confidence: 99%

Improved Behavior of Copper–Amine Complexes During Thermal Annealing for Conductive Thin Film Synthesis

Ayag

Panama

Paul

et al. 2017

Bulletin Korean Chem Soc

View full text Add to dashboard Cite

Previous studies successfully produced conductive thin films from organo‐metallic‐compounds‐based inks. Some inks like those made from copper salt and amines, however, tend to move during thermal annealing and, thus, affect the conductive pattern on the substrate. In this study, conductive inks were synthesized by forming complexes of copper with amines and/or blended amines. To build‐up an organo‐metallic framework and preserve the pattern throughout the annealing period, diamine was added to the complex in different proportions. The prepared inks were coated on glass substrate and were annealed on a hot plate at 170°C under the gaseous mixture of formic acid and alcohol for 5 min. The metallic film was observed to retain the original pattern of the ink during and after annealing. Adhesion on the substrate was also improved. Inks with blended amines produced films with lower resistivities. The lowest electrical resistivity recorded was 4.99 μΩ cm, three times that of bulk copper.

show abstract

Section: Resultsmentioning

confidence: 99%

Improved Behavior of Copper–Amine Complexes During Thermal Annealing for Conductive Thin Film Synthesis

Ayag

Panama

Paul

et al. 2017

Bulletin Korean Chem Soc

View full text Add to dashboard Cite

show abstract

“…To lower the decomposition temperature, CuF is usually mixed with complexing agents, such as alkylamines 30,31 or pyridine derivatives. 32 These organic copper complexes can decompose at temperatures as low as 100 C. 32,33 Moreover, with a low sintering temperature, one can also print the copper MOD ink on plastic sheets to make exible conductive patterns.…”

Section: -29mentioning

confidence: 99%

Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

et al. 2017

View full text Add to dashboard Cite

In this study, a thermally triggered self-reducible copper ink is developed to print conductive patterns on flexible substrates. Inks containing only copper formate (CuF) and monoisopropanol amine (MIPA) generated large bubbles in the CuF decomposing process, and thus the surface morphologies of prepared thin films were largely disturbed. With the addition of octylamine (OA), the bubbling disturbance was relieved due to the lower surface tension and the film uniformity was greatly improved. A low resistivity of 2 Â 10 À7 U m (8.5% of bulk copper) can be reached by heating the ink at 140 C for 5 minutes under a nitrogen environment. XRD results showed the synthesized copper films were comprised of pure metallic copper crystalline. The copper films were composed of closely packed spherical grains of 50 to 500 nm in diameter. After the addition of 1 wt% polyvinylpyrrolidone (PVP) in the ink, the synthesized copper thin films showed great adhesion on glass substrates, and sustained the same conductivity after repeated tape tests.The ink can also be printed on flexible substrates, such as polyethylene terephthalate (PET) or polyimide (PI) thin films, to create highly-conductive tracks with a strong mechanical stability. Finally, various conductive patterns were printed on flexible substrates to show the great potential of this ink for various printed electronic applications. IntroductionThe recent advancements in printing technology have provided a new fabrication method for exible and light-weight electronic devices at low costs. To fabricate these so-called printed electronic devices, inks containing conductive materials are printed on plastic sheets to produce exible microelectronic circuits. As the most essential part in every circuit, electrically conductive interconnects from metal inks have been widely used in these printed devices. To reduce the manufacturing cost, copper has recently attracted wide attention for printed conductive features because of its low price, and high electric conductivity. The most commonly used copper inks are nanoparticle suspensions. 1-7 The printed patterns can yield a low resistivity down to 2.2 times of that for bulk copper 2 aer sintering at 200 C for an hour. However, most plastic substrates might melt or deform at this high temperature. Alternatively, electroless plating approach offers a low-temperature synthetic route for copper thin lm fabrication on plastic surfaces. 8-11Solutions containing active agents are rst printed with microcontact 12-14 or inkjet printing 15-20 methods to produce patterns on plastic substrates. Copper metal are then deposited selectively on the printed patterns in a subsequent electroless plating bath. 12,13,15,16,19 Although electroless plating methods can produce highly conductive copper thin lms on exible substrates at low temperatures, the method needs two processing steps and the plating uid might contaminate or modify the plastic surfaces other than the patterned area. Thus, copper inks that can directly print on selected area with l...

show abstract

“…One type is a suspension or dispersion of fine copper particles or nanoparticles1415161718192021. The other type is the copper-based metal-organic decomposition (MOD) ink, which is composed of a copper salt, amine/amino hydroxyl ligands and other organic components22425262728. Copper-based MOD ink, which has merits such as simplicity and scalability, has been studied for achieving high electrical conductivity at a low sintering temperature.…”

mentioning

confidence: 99%

“…In addition, we studied ligands of copper formate (CuF)/alkanolamines complexes24. In many cases, copper-based MOD ink was composed of CuF22425262728 because CuF itself is self-reducible. Our results demonstrated that the added commercial copper particles, which directly contribute to the conductivity of the sintered films and to a higher packing density, resulted in the sintering of copper films at a low temperature, forming highly conductive copper films.…”

mentioning

confidence: 99%

“…A low resistivity of 9.0 × 10 −6 Ω·m at a sintering temperature of 100 °C without a reductive gas was achieved. Further, for achieving a low resistivity (on the order of 10 −8 Ω·m–10 −6 Ω·m), mixing the copper complex with submicron copper particles for MOD inks offered a lower sintering temperature compared to mixing copper complex with other organic components22425262728. This method is highly promising, but a detailed study of the copper salts for synthesizing copper complex and the effect of the size of the copper particles in MOD inks has not been reported so far.…”

mentioning

confidence: 99%

See 1 more Smart Citation

Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Yong

Nguyen

Tsukamoto

et al. 2017

Sci Rep

View full text Add to dashboard Cite

Mixtures of a copper complex and copper fine particles as copper-based metal-organic decomposition (MOD) dispersions have been demonstrated to be effective for low-temperature sintering of conductive copper film. However, the copper particle size effect on decomposition process of the dispersion during heating and the effect of organic residues on the resistivity have not been studied. In this study, the decomposition process of dispersions containing mixtures of a copper complex and copper particles with various sizes was studied. The effect of organic residues on the resistivity was also studied using thermogravimetric analysis. In addition, the choice of copper salts in the copper complex was also discussed. In this work, a low-resistivity sintered copper film (7 × 10−6 Ω·m) at a temperature as low as 100 °C was achieved without using any reductive gas.

show abstract

Electrically conductive copper film prepared at low temperature by thermal decomposition of copper amine complexes with various amines

Cited by 75 publications

References 25 publications

Improved Behavior of Copper–Amine Complexes During Thermal Annealing for Conductive Thin Film Synthesis

Improved Behavior of Copper–Amine Complexes During Thermal Annealing for Conductive Thin Film Synthesis

Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Contact Info

Product

Resources

About