Electrically Conductive Adhesives

Lyons, Alan M.; Dahringer, D.

doi:10.1201/9780203912225.ch45

Cited by 3 publications

(1 citation statement)

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“…They are also being increasingly exploited to replace tin and lead solders because of environmental concerns. 1,2 Silver-filled epoxy composites are widely used conductive adhesives, in which epoxy resins wet and bond to almost all surfaces, showing high performances, whereas silver offers advantages of a high level of conductivity and conductivity stability. 1,3 Many other kinds of conductive fillers in filled epoxy resin conductive adhesives were studied and are being explored as lower cost alternatives.…”

Section: Introductionmentioning

confidence: 99%

The conductivity behavior of multi‐component epoxy, metal particle, carbon black, carbon fibril composites

Jia

Tchoudakov

Joseph

et al. 2002

J of Applied Polymer Sci

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ABSTRACT:Following the previous studies of epoxy/silver conductive composites, a detailed investigation of the influence of ethylene glycol on the resulting resistivity of various composites was carried out. Ethylene glycol was found to have a catalytic effect on the curing process of the epoxy resin, verified by differential scanning calorimetry studies. The accelerated curing process diminishes settling of the metal particles and therefore results in better and more uniform conductivities. High temperature curing of the composites was found to have a similar effect on the conductivity. The conductivity behavior of some other composites, such as epoxy/nickel, epoxy/nickel/carbon fibrils, and epoxy/carbon black/carbon fibrils, were also studied. The structure-property relations were better understood through scanning electron microscopy observations. Silver and nickel particles were found to perform differently in the cured epoxy, showing different percolation concentrations and conductivity levels.

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Section: Introductionmentioning

confidence: 99%