Bi<sub>2</sub>Te<sub>3</sub>-based alloys have been extensively studied as thermoelectric materials near room temperature. In this study, the electrical, thermal, and thermoelectric transport properties of a series of Co-doped <i>n</i>-type Cu<sub>0.008</sub>Bi<sub>2</sub>Te<sub>2.6</sub>Se<sub>0.4</sub> polycrystalline alloys (Cu<sub>0.008</sub>Bi<sub>2−x</sub>Co<sub>x</sub>Te<sub>2.6</sub>Se<sub>0.4</sub>, <i>x</i> = 0, 0.03, 0.06, 0.09 and 0.12) are investigated. The electrical conductivity of the Cu<sub>0.008</sub>Bi<sub>1.97</sub>Co<sub>0.03</sub>Te<sub>2.6</sub>Se<sub>0.4</sub> (<i>x</i> = 0.03) sample was significantly enhanced, by 34%, to 1199 S/cm compared to 793 S/cm of the pristine Cu<sub>0.008</sub>Bi<sub>2</sub>Te<sub>2.6</sub>Se<sub>0.4</sub> (<i>x</i> = 0) sample at 300 K, and gradually decreased to 906 S/cm for <i>x</i> = 0.12 upon further doping. Power factors of the Co-doped samples decreased compared to the 3.26 mW/mK<sup>2</sup> of the pristine Cu<sub>0.008</sub>Bi<sub>2</sub>Te<sub>2.6</sub>Se<sub>0.4</sub> sample at 300 K. Meanwhile, the power factor of the Cu<sub>0.008</sub>Bi<sub>1.97</sub>Co<sub>0.03</sub>Te<sub>2.6</sub>Se<sub>0.4</sub> (<i>x</i> = 0.03) sample became higher at 520 K. The lattice thermal conductivities of the Co-doped samples decreased due to additional point defect phonon scattering by the Co dopant. Consequently, the <i>zT</i> for the Cu<sub>0.008</sub>Bi<sub>1.97</sub>Co<sub>0.03</sub>Te<sub>2.6</sub>Se<sub>0.4</sub> alloy at 520 K was 0.83, which is approximately 15% larger than that of pristine Cu<sub>0.008</sub>Bi<sub>2</sub>Te<sub>2.6</sub>Se<sub>0.4</sub>, while the <i>zT</i> of the Cu doped samples at 300 K was smaller than that of the pristine Cu<sub>0.008</sub>Bi<sub>2</sub>Te<sub>2.6</sub>Se<sub>0.4</sub> sample. Electrical transport properties of the Co-doped Cu<sub>0.008</sub>Bi<sub>2−x</sub>Co<sub>x</sub>Te<sub>2.6</sub>Se<sub>0.4</sub> samples were analyzed by experimental phenomenological parameters, including the density-of-state, effective mass, weighted mobility, and quality factor.