Electrical simulation of gold bonding wire with different parameters

Wang, Dejing; Zhao, Yuanfu; Yao, Quanbin; Lian, Binhao; Zhang, Hongshuo

doi:10.1109/icept.2015.7236824

Cited by 5 publications

(1 citation statement)

References 2 publications

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“…Taking into account the skin effect, the equivalent capacitance value of the bondwire with span S and arc height h a can be expressed as (1)–(3), 21–23 where the inductance of the bondwire itself is L w , and the mutual inductance to the ground is M g . It is worth noting that the thickness of the substrate may affect the mutual inductance between the bonding wire and the ground, and the critical value is about 500 μm 5 .…”

Section: Bondwire Equivalent Model and Analysis Of Electrical Propertiesmentioning

confidence: 99%

Study of harmonic control power amplifier technology based on improved modeling of bondwire

Zhong

Song

et al. 2022

Int J RF Mic Comp-Aid Eng

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Wire bonding is widely used in various radio frequency (RF) devices and is one of the common forms of signal interconnection. In this article, a new geometric model with related physical parameters is used to describe various actual types of the bondwire, and the corresponding calculation method for the total length of the bondwire is obtained. Consequently, a new equivalent circuit modeling method of the single‐bondwire can be developed and the accuracy of model has been improved. On this basis, using the concept of partial inductance, the modeling method of double‐bondwire is proposed, which can be applied to asymmetric double‐bondwire modeling. The model of bondwire obtained by this modeling method is applied to the design of PA, and the special electrical properties of the bondwire are used to verify a novel harmonic control method, which second and third harmonics could be controlled. The results show that in the Sub‐6G, the proposed bondwire model has good accuracy, and its performance is close to the measured results. The designed PA combined with harmonic control network has good performance, achieving drain efficiency of 62.6%–70% and output power of 40–41.5 dBm at 3.2–3.8 GHz. It is proved that the proposed bonding line modeling method can be applied to the design of high‐efficient PA.

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Section: Bondwire Equivalent Model and Analysis Of Electrical Propertiesmentioning

confidence: 99%