Electrical Property and Surface Morphology of Silver Nanoparticles After Thermal Sintering

Ryu, Kyongtae; Moon, Yoon-Jae; Park, Kyung-Hoon; Hwang, Jeongjae; Moon, Seung-Jae

doi:10.1007/s11664-015-4073-1

Cited by 30 publications

(15 citation statements)

References 15 publications

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“…These results are consistent with the resistivity of 5-30 µ • cm specified in the SunTronic ink manufacturer datasheet. Also, the results are in the same order as those reported in previous studies [27], [40], [61], [62]. Measured resistivities are higher than bulk silver resistivity because printed silver has smaller grain size and higher porosity than bulk silver.…”

Section: B Electrical DC Characterizationsupporting

confidence: 85%

Comparative Study of Inkjet-Printed Silver Conductive Traces With Thermal and Electrical Sintering

et al. 2019

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Thermal sintering has traditionally been the most popular sintering method to enhance conductivity after the printing process in the manufacturing of printed electronics. Nevertheless, in recent years, there has been a growing interest in electrical sintering as an alternative method to overcome some of the limitations of thermal curing. This paper makes a comparative study of both sintering methods in terms of surface morphology, electrical dc conductance, and radiofrequency performance for different applied voltage waveforms. To this end, microstrip transmission lines have been inkjet-printed using nanoparticle-based silver ink on flexible polyimide substrate. The traces have been tested under different sintering conditions, achieving electrical sintering resistivity values only 2.3 times higher than that of bulk silver. This implies a 62% reduction in comparison with the best resistivity value achieved using thermal sintering in our samples. The main novelty of this contribution lies in the analysis of RF behavior as a function of electrical sintering conditions. Lower resistivities have been achieved with slower voltage ramps or allowing higher density current during sintering. It has also been proved that electrically sintered lines have similar RF performance than high-temperature thermally sintered lines in terms of insertion losses, regardless of their very different surface topology. Therefore, we can take advantage of the benefits that electrical sintering offers over thermal sintering regarding significant shorter sintering times maintaining suitable RF performance.INDEX TERMS Electrical sintering, inkjet printing, microstrip transmission line, silver nanoparticle ink, thermal sintering.

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Section: B Electrical DC Characterizationsupporting

confidence: 85%

Comparative Study of Inkjet-Printed Silver Conductive Traces With Thermal and Electrical Sintering

et al. 2019

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“…For comparison, a few silver nanostructures with better electrical properties that have been reported in the literature and used for flexible circuits are shown in Figure . Generally, the nanoparticles or nanoflakes formed under high temperatures show superior electric conductivities from 150 to 250 °C.…”

Section: Resultsmentioning

confidence: 99%

Enhanced Electrical and Mechanical Properties of a Printed Bimodal Silver Nanoparticle Ink for Flexible Electronics

Liu

Wang

et al. 2018

Physica Status Solidi (a)

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Electrical patterns that can be formed with high electrical conductivity and mechanical robustness under mild conditions are critical for developing flexible electronics with heat-sensitive substrates. Here, the authors synthesize bimodal Ag nanoparticle (AgNP) inks by mixing two sizes of AgNPs (10 and 50 nm) and sintering them at room temperature in air on photopaper without any heat or chemical treatment. The optimized particle size ratio, sintered microstructures, and properties of the bimodal inks are systematically investigated and compared with those of the unimodal inks. These inks are printed and sintered at room temperature in air using accurate and controllable washing processes. An optimized resistivity as low as 3.66Â10 À6 Ω cm is obtained when the ratio of the 10 nm AgNPs to the 50 nm AgNPs is 2:1. The bimodal ink could be printed in a short time and exhibited good bending performance with reduced coffeering defects. The enhanced performance indicates that even just by matching the particle sizes and using the appropriate cleaning process, the bimodal AgNPs ink could be sintered with uniform morphologies throughout the repeated printing process to achieve a remarkably low resistivity. The proposed water-based bimodal AgNP ink will enable one-step inkjet printing and sintering for the first time with improved properties and convenience for developing highly sensitive flexible substrates and devices.

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“…Silver-based inks are currently preferred due to their excellent electrical conductivity and stability in air, and silver is relatively inexpensive compared to gold [ 16 , 25 ]. Additives such as polyvinylpyrrolidone (PVP) [ 26 , 27 , 28 ], polyacrylic acid (PAA) [ 8 , 29 , 30 ], 2-amino-2-methyl-1-propanol (AMP) [ 31 ], and tetradecane [ 32 ] are generally added to improve the ink’s uniformity during preparation, avoiding aggregation and thus improving the reliability of the printing process.…”

Section: Introductionmentioning

confidence: 99%

Effectiveness of Oxygen during Sintering of Silver Thin Films Derived by Nanoparticle Ink

et al. 2022

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Silver nanoparticle (NP) inks have been widely used in the ink-jet printing field because of their excellent properties during low-temperature sintering. However, the organic dispersant used to prevent the aggregation and sedimentation of NPs can hinder the sintering process and result in the high resistivity of sintered films. In this study, silver thin films derived from silver NP ink with polyvinylpyrrolidone (PVP) dispersant were sintered in different atmospheres of pure nitrogen, air, and pure oxygen. The effect of the oxygen content in the sintering atmosphere on the thermal properties of the ink, the electrical resistivity and microstructure of the sintered films, and the amount of organic residue were studied by using differential scanning calorimetry, the four-point probe method, scanning electron microscopy, Fourier transform infrared spectroscopy, etc. The mechanism of optimizing the film resistivity by influencing the decomposition of the PVP dispersant and the microstructure evolution of the silver thin films through the sintering atmosphere was discussed. The results demonstrated that an oxygen-containing atmosphere could be effective for silver NPs in two ways. First, the oxygen content could enhance the diffusion ability of silver atoms, thus accelerating the stage transition of microstructural evolution at low temperatures. Second, the oxygen content could enable the PVP to decompose at a temperature much lower than in conditions of pure nitrogen, thus helping to finalize the densification of a silver film with a low resistivity of 2.47 μΩ·cm, which is approximately 1.5-fold that of bulk silver. Our findings could serve as a foundation for the subsequent establishment of ink-jet printing equipment and the optimization of the sintering process for printing silver patterns on flexible substrates.

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Electrical Property and Surface Morphology of Silver Nanoparticles After Thermal Sintering

Cited by 30 publications

References 15 publications

Comparative Study of Inkjet-Printed Silver Conductive Traces With Thermal and Electrical Sintering

Comparative Study of Inkjet-Printed Silver Conductive Traces With Thermal and Electrical Sintering

Enhanced Electrical and Mechanical Properties of a Printed Bimodal Silver Nanoparticle Ink for Flexible Electronics

Effectiveness of Oxygen during Sintering of Silver Thin Films Derived by Nanoparticle Ink

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