2013
DOI: 10.7567/jjap.52.01ac01
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Electrical Properties of ZnO-Doped Nd(Co1/2Ti1/2)O3 Thin Films Prepared by RF Magnetron Sputtering

Abstract: The electrical properties and microstructures of ZnO-doped Nd(Co1/2Ti1/2)O3 thin films prepared by rf-magnetron sputtering on indium tin oxide (ITO)/glass substrates at different rf powers and Ar/O2 ratios have been investigated. X-ray diffraction pattern analysis showed that the deposited films exhibited a polycrystalline microstructure. All films exhibited the ZnO-doped Nd(Co1/2Ti1/2)O3 orientation perpendicular to the substrate surface, and the uniformity of surface morphologies of the film increased with d… Show more

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Cited by 9 publications
(4 citation statements)
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“…8,9) ZnO fulfills both requirements, 10) and is easy for the thin film formation by a magnetron sputtering method at low temperature, such as at room temperature to 200 °C. [11][12][13][14][15] In addition, zinc is a common metal, so ZnO-based SAW sensors will be advantageous also from the view point of the economy. 16) In the present work, the design of ZnO-based SAW sensors will be dealt with, together with the optimization of electrode materials.…”
Section: Introductionmentioning
confidence: 99%
“…8,9) ZnO fulfills both requirements, 10) and is easy for the thin film formation by a magnetron sputtering method at low temperature, such as at room temperature to 200 °C. [11][12][13][14][15] In addition, zinc is a common metal, so ZnO-based SAW sensors will be advantageous also from the view point of the economy. 16) In the present work, the design of ZnO-based SAW sensors will be dealt with, together with the optimization of electrode materials.…”
Section: Introductionmentioning
confidence: 99%
“…Dielectric films with low leakage current and high dielectric constant are of great interest for a variety of integrated devices, such as RF chip capacitors, transistors, and dynamic random access memory. [1][2][3][4][5][6][7][8] These prepared dielectric thin films are also beneficial for reducing the dimensions of integrated devices. In order to achieve miniaturization of the dimensions of integrated devices, several researchers have been discussing the development of high-dielectricconstant dielectric thin films for use in microwave electronic integrated devices.…”
Section: Introductionmentioning
confidence: 99%
“…Dielectric thin films with high dielectric constant, low dielectric loss, and low leakage current are of great importance for a variety of integrated devices, such as chip capacitors, memory cells of dynamic random access memories (DRAMs), and devices used in microwave integrated circuit systems. [1][2][3][4] Thin-film chip capacitors fabricated using an interdigital (IDT) electrode pattern are often used in the fabrication of microwave integrated circuits. The characteristics of thin-film chip capacitor elements include capacitance per unit area, temperature coefficient of capacitance, leakage current, dielectric loss, and dielectric strength.…”
Section: Introductionmentioning
confidence: 99%