2009
DOI: 10.3938/jkps.55.1079
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Electrical Properties of SrTiO$_{3}$-epoxy Composite ThickFilmson Cu Plate PCB substrates

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“…This might participate to improve the overall reliability by mitigating strong localized electric fields. As homogeneously-mixed polymer composites can present some limitation due to the filler content it is reasonably possible to add to the matrix, the dielectric properties can flatten accordingly [4] [5]. In order to overcome this limitation, the composite filler architecture can be modified by using specific 3D electric field assembly techniques that enable to increase the composite dielectric properties.(e.g.…”
Section: Introductionmentioning
confidence: 99%
“…This might participate to improve the overall reliability by mitigating strong localized electric fields. As homogeneously-mixed polymer composites can present some limitation due to the filler content it is reasonably possible to add to the matrix, the dielectric properties can flatten accordingly [4] [5]. In order to overcome this limitation, the composite filler architecture can be modified by using specific 3D electric field assembly techniques that enable to increase the composite dielectric properties.(e.g.…”
Section: Introductionmentioning
confidence: 99%