2009
DOI: 10.1016/j.mseb.2008.10.043
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Electrical properties of n-type multicrystalline silicon for photovoltaic application—Impact of high temperature boron diffusion

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Cited by 11 publications
(10 citation statements)
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“…These impurities may exist in different states, for example, interstitially dissolved, as metal-silicide precipitates, or as larger micron-sized particles [11]. Energy distribution of trapping states induced by these defects at grain boundaries has a Gaussian distribution [13,14].…”
Section: A Gettering Process and Lifetimementioning
confidence: 99%
“…These impurities may exist in different states, for example, interstitially dissolved, as metal-silicide precipitates, or as larger micron-sized particles [11]. Energy distribution of trapping states induced by these defects at grain boundaries has a Gaussian distribution [13,14].…”
Section: A Gettering Process and Lifetimementioning
confidence: 99%
“…Using ion implantation, excimer laser annealing, and thermal diffusion of dopants into the Si wafer forming a p-n junction are expensive approaches [2,[6][7][8][9][10][11]. Typically, thermal diffusion is produced by heat treatment in a conventional furnace at temperatures above 900 • C for durations ranging from minutes to hours.…”
Section: Introductionmentioning
confidence: 99%
“…The usual B diffusion model, which takes into account the variation of the B lattice diffusion coefficient with B concentration, fails to explain the profiles measured in nc-Si. In contrast, B diffusion profiles can be well fitted using a model that takes into account moving grain boundaries with a B-concentration-dependent migration rate.Polycrystalline Si (poly-Si) and in particular nanocrystalline Si (nc-Si) thin films are of great interest for the fabrication of devices such as Si-based solar cells and optoelectronic devices [1][2][3][4]. Usually, device properties depend on the properties of p/n junctions created in the semiconductor (homogeneity of dopant distribution, doping level, junction abruptness and depth, etc.).…”
mentioning
confidence: 99%
“…Usually, device properties depend on the properties of p/n junctions created in the semiconductor (homogeneity of dopant distribution, doping level, junction abruptness and depth, etc.). Among the different processes allowing for poly-Si and nc-Si doping for junction production, processes based on dopant diffusion have the benefit of providing dopant activation during diffusion annealing without cluster formation at low cost [3]. This is the reason why this type of process is currently widely used in solar cell production.…”
mentioning
confidence: 99%
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