2019
DOI: 10.1088/1361-6641/aafc6a
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Electrical profiling of arsenic-implanted HgCdTe films performed with discrete mobility spectrum analysis

Abstract: The results from the electrical profiling of an n-on-p junction formed by 190-keV arsenic ion implantation in an indium/vacancy-doped Hg 0.78 Cd 0.22 Te film are presented. Mobility spectrum analysis in combination with wet chemical etching has been employed for the profiling. After the implantation, a typical n + -n-р structure was observed and three electron species were detected: (a) low-mobility electrons in the 400-500 nm-thick top radiation-damaged n + -layer, (b) midmobility electrons also originating f… Show more

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Cited by 10 publications
(7 citation statements)
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“…A disappeared, while the dislocation loops transformed into single dislocations with a higher density (an upper layer B 1 ' with thickness ∼ 120 nm) and a lower density (a lower layer B 2 ' with thickness ∼ 170 nm). The results of the TEM studies clearly confirm partial annealing of defects that are known to capture Hg I and provide n-type conductivity in as-implanted MCT [12].…”
Section: (B)) the Low-defect Layersupporting
confidence: 53%
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“…A disappeared, while the dislocation loops transformed into single dislocations with a higher density (an upper layer B 1 ' with thickness ∼ 120 nm) and a lower density (a lower layer B 2 ' with thickness ∼ 170 nm). The results of the TEM studies clearly confirm partial annealing of defects that are known to capture Hg I and provide n-type conductivity in as-implanted MCT [12].…”
Section: (B)) the Low-defect Layersupporting
confidence: 53%
“…The details of the extraction of carrier parameters from the mobility spectra were given in Ref. [12] on the example of arsenic-implanted n + -on-p MCT structures. Figure 2 shows the transformation of primary mobility spectrum envelopes (MSEs) calculated according to the standard MSA algorithm developed by Beck and Anderson [18] for samples F2 and F3.…”
Section: Resultsmentioning
confidence: 99%
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