Proceedings of the 2017 2nd International Conference on Modelling, Simulation and Applied Mathematics (MSAM2017) 2017 Help me understand this report
Electrical Performance Simulation of 2.5D Package
Abstract: Abstract-In this paper, the influence of TSV geometry parameters on transmission performance is analyzed and some TSV design references are given according to the simulation results. In addition, including coplanar waveguide (CPW) and microstrip line (MSL), two main signal line structures of RDL layer are studied and their transmission performance is compared.
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